Voice Collection Device Sealing Structure
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Solution Overview
Problem
Existing voice recognition devices with high-quality sound pickup face challenges due to the limitations of silicone seals in compact designs, which result in poor space utilization and stability issues.
Innovation Solution
A voice collection device featuring a microphone assembly with a dust filter and a first adhesive layer, bonded to the housing, forming a sound pickup main channel, effectively seals gaps other than the sound pickup channel, eliminating the need for a silicone seal and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a silicone seal is used to suppress sound pickup outside the main channel, then sound isolation performance is improved, but space utilization deteriorates and structural stability deteriorates
Solution Approach 1:
The patent removes the silicone seal from the structure and replaces it with a sealing frame integrated into the housing. The sealing frame includes a sealing surface that directly contacts the microphone assembly, eliminating the need for additional silicone sealing materials while maintaining sound isolation performance.
Solution Approach 2:
The sealing function is merged with the housing structure itself. The sealing frame is formed as an integrated part of the housing, combining the structural support function with the sound sealing function, thereby improving space utilization and structural stability.
2Object-affected harmful factors
If a silicone seal is used to suppress sound pickup outside the main channel, then sound isolation performance is improved, but structural stability deteriorates
Solution Approach 1:
The patent removes the silicone seal which caused stability issues and replaces it with a rigid sealing frame structure that provides both sound isolation and structural stability.
Solution Approach 2:
The sealing frame includes a sealing surface with specific geometric features that ensure stable contact with the microphone assembly. The structured design provides mechanical stability while maintaining effective sound sealing.
3Volume of moving object
If the internal structure is made compact to improve device miniaturization, then device dimension is reduced, but sealing effectiveness deteriorates
Solution Approach 1:
The sealing function is merged with the compact housing structure. The sealing frame is integrated into the housing design, allowing effective sound sealing within a compact form factor without requiring additional external sealing components.
Solution Approach 2:
The patent uses a sealing surface that extends across the housing interior in a planar configuration, creating an effective sealing barrier within the limited three-dimensional space of the compact device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances sound pickup accuracy and stability by sealing external noise effectively, improving the compactness and reliability of voice recognition devices without requiring additional silicone structures for pressing.
Implementation Method 1
a first adhesive layer, wherein one side of the microphone circuit board is connected to the dust filter, the other side of the microphone circuit board is connected to the microphone main body, and the microphone circuit board and the dust filter are bonded to the inner side of the housing through the first adhesive layer
Data Source
AI summary
The present disclosure provides a voice collection device, comprising: a housing; a microphone assembly disposed inside the housing and including a microphone main body and a microphone circuit board; and a sealing structure disposed between the microphone assembly and an inner side of the housing and including a dust filter and a first adhesive layer. One side of the microphone circuit board is connected to the dust filter. The other side of the microphone circuit board is connected to the microphone main body. The microphone circuit board and the dust filter are bonded to the inner side of the housing. A sound hole is configured on the microphone main body. A first through-hole is configured at a position on the microphone circuit board corresponding to the sound hole. A second through-hole is configured at a position on the housing corresponding to the first through-hole.