Void-Free Dielectric Window Coating for Plasma Tool Durability

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Plasma treatment tools in integrated circuit fabrication face issues with stress concentration in protective coatings on dielectric windows, leading to cracking and peeling, which reduces tool uptime and wafer quality due to particulate defects.

Innovation Solution

A void-free protective coating is applied to the dielectric window using a two-layer process, with a first layer polished to create a flat surface and a second layer applied, incorporating yttrium-based materials like Y2O3, and using PVD or CVD for higher hardness and crystallinity, and CMP for polishing, ensuring an uncoated annular retreat area around the central hole to reduce stress and voids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective coating is applied to the dielectric window, then the window is protected from plasma damage, but stress concentration occurs leading to cracking and peeling

Engineering Contradiction:

Improveprotective coating durabilityVSAvoidcoating integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The protective coating is divided into two distinct layers: a first protective coating layer and a second protective coating layer. This segmentation allows each layer to serve different functions - the first layer provides stress relief and a flat surface, while the second layer provides the primary protective function with higher hardness and crystallinity, preventing cracking and peeling

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first protective coating layer is applied and polished to create a flat surface before applying the second protective coating layer. This preliminary action of creating a flat, stress-relieved surface prevents void formation and stress concentration that would otherwise lead to coating failure

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If a single-layer protective coating is applied, then the application process is simple, but voids form leading to stress concentration and coating failure

Engineering Contradiction:

Improvecoating application simplicityVSAvoidcoating defect-free quality

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The coating process is segmented into two distinct deposition steps: first applying the first protective coating layer, then applying the second protective coating layer. This segmentation enables the elimination of voids through the flatting effect of polishing the first layer, while maintaining a manageable two-step manufacturing process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first protective coating layer acts as an intermediary between the dielectric window substrate and the second protective coating layer. It provides a flat, void-free intermediate surface that prevents defect formation in the final coating structure

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If the protective coating is applied around the central hole, then complete coverage is achieved, but stress concentration occurs at the hole perimeter

Engineering Contradiction:

Improvecoating coverage areaVSAvoidstress concentration at central hole

Core Design Contradiction:

Area of stationary objectVSStress or pressure

Solution Approach 1:

The first protective coating layer is selectively applied around the central hole area and polished to create a flat surface that specifically addresses stress concentration at the hole perimeter. This local treatment provides stress relief where most needed while maintaining complete protective coverage in the final two-layer structure

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution extends the service lifetime of plasma treatment tools, improves wafer quality by reducing particulates, and enhances coating durability, resulting in better performance in wafer acceptance tests and circuit probing.

Implementation Method 1

PVD or CVD for higher hardness and crystallinity

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

PVD or CVD for higher hardness and crystallinity

Methodology Applied

Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Implementation Method 3

CMP for polishing

Methodology Applied

Scientific EffectChemical mechanical polishing:

Implementation Method 4

incorporating yttrium-based materials like Y2O3, and using PVD or CVD for higher hardness and crystallinity

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS20230367339A1Methods for preparing void-free coatings for plasma treatment components

Publication Date: 2023.11.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.