Void-Free Dielectric Window Coating for Plasma Tool Uptime

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Solution Overview

Problem

Plasma treatment tools in integrated circuit fabrication face issues with stress concentration in protective coatings on dielectric windows, leading to cracking and peeling, which reduces tool uptime and wafer quality due to particulate defects.

Innovation Solution

A void-free protective coating is applied to the dielectric window using a two-layer process, with a first layer polished to create a flat surface and a second layer applied, utilizing yttrium-based materials like Y2O3, and employing PVD or CVD for higher hardness and crystallinity, and CMP for polishing, ensuring an uncoated retreat area around the central hole to reduce stress and voids.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective coating is applied to the dielectric window, then the window is protected from plasma damage, but stress concentration occurs leading to cracking and peeling

Engineering Contradiction:

Improveprotective coating durabilityVSAvoidcoating integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent divides the protective coating into two separate layers: a first protective coating layer and a second protective coating layer. This segmentation allows each layer to serve specific functions - the first layer provides stress relief and the second layer provides the primary protective function, thereby preventing cracking and peeling while maintaining coating durability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first protective coating layer is applied and polished to create a flat surface before applying the second protective coating layer. This preliminary action of creating a flat, stress-relieved base layer prevents stress concentration that would otherwise cause cracking and peeling of the subsequent layers

Inventive Principle:

Principle #10Preliminary action

2Reliability

If a protective coating is applied to the dielectric window, then the window is protected, but voids form in the coating reducing quality

Engineering Contradiction:

Improveprotective coating durabilityVSAvoidcoating uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The first protective coating layer is polished to create a flat surface before applying the second layer. This preliminary polishing action eliminates voids and creates a uniform base, ensuring that the final multi-layer coating is void-free and meets manufacturing precision requirements

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical and chemical parameters of the coating by using different materials for the first and second layers (e.g., yttrium-based materials like Y2O3). This parameter change optimizes the coating properties to eliminate voids while maintaining durability

Inventive Principle:

Principle #35Parameter changes

3Productivity

If the dielectric window is used in plasma treatment, then wafer processing is enabled, but tool uptime is reduced due to coating failure

Engineering Contradiction:

Improvewafer processing capabilityVSAvoidtool uptime

Core Design Contradiction:

ProductivityVSDuration of action of stationary object

Solution Approach 1:

By segmenting the protective coating into two layers with different functional optimizations, the patent prevents coating failure that would otherwise require tool downtime for maintenance, thereby extending tool uptime while maintaining wafer processing capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses composite material structure with yttrium-based materials (e.g., Y2O3) in the protective coating layers. This composite approach creates a more durable coating system that resists plasma damage longer, extending tool uptime between maintenance cycles

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution extends the service lifetime of plasma treatment tools, improves wafer quality by minimizing particulates, and enhances the protective coating's durability and uniformity, resulting in better performance in wafer acceptance tests and circuit probing.

Implementation Method 1

employing PVD or CVD for higher hardness and crystallinity

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

employing PVD or CVD for higher hardness and crystallinity

Methodology Applied

Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

employing PVD or CVD for higher hardness and crystallinity, and employing CMP for polishing

Methodology Applied

Scientific EffectChemical Mechanical Polishing:

Data Source

PatentUS11875973B2Methods for preparing void-free coatings for plasma treatment components

Publication Date: 2024.01.16 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.