LED Panel Repair With Volatile Adhesive Unit Replacement
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Solution Overview
Problem
Conventional display devices using light-emitting diodes (LEDs) cannot repair damaged LED chips fixed on circuit substrates, leading to functional failures.
Innovation Solution
A method involving the removal of damaged LED units, application of a volatile adhesive material to new LED units, and precise placement using a pick and place module to affix them to the circuit substrate, allowing for the replacement and repair of damaged units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED chips are fixed onto the circuit substrate, then the display device achieves full color light emission, but the damaged LED chip cannot be repaired
Solution Approach 1:
The patent changes the physical state of the adhesive material from permanent to volatile by using materials that can be removed through heating or chemical treatment. This allows the LED chip to be detached and replaced, transforming the irreversible bonding process into a reversible one, thereby enabling repairability without significantly complicating the manufacturing process.
Solution Approach 2:
The patent introduces a volatile adhesive material as an intermediary between the LED chip and the circuit substrate. This intermediary substance enables temporary bonding during operation but can be easily removed when repair is needed, facilitating chip replacement while maintaining a relatively simple manufacturing process.
2Ease of repair
If a damaged LED chip is replaced with a new one, then the functionality is restored, but the adhesive material must be removed and reapplied
Solution Approach 1:
The volatile adhesive material undergoes parameter changes (phase transition or chemical decomposition) when exposed to heat or chemical agents, allowing for easy removal. This enables rapid chip replacement by transforming the adhesive from a bonding state to a removable state, reducing repair time while maintaining ease of replacement.
Solution Approach 2:
The patent replaces mechanical bonding (permanent adhesive) with a chemical/thermal system where the adhesive can be deactivated through heating or chemical treatment. This substitution allows for non-mechanical removal of the adhesive, facilitating faster and easier chip replacement without requiring forceful mechanical separation.
3Adaptability or versatility
If volatile adhesive material is used to affix LED chips, then the chips can be replaced, but the manufacturing process becomes more complex
Solution Approach 1:
The volatile adhesive material is selected to undergo predictable parameter changes (evaporation, decomposition) under controlled conditions. This allows the manufacturing process to incorporate simple heating or chemical treatment steps for adhesive removal and reapplication, enabling chip replacement capability while keeping the manufacturing process relatively straightforward and scalable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the effective replacement of damaged LED units, maintaining the functionality and color performance of LED panels by ensuring continuous operation without the need for complete panel replacement.
Implementation Method 1
melting and solidifying the first volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position
Implementation Method 2
applying a flux onto the circuit substrate; using a second volatile adhesive material to affix the plurality of LED chips onto the circuit substrate
Data Source
AI summary
A method for repairing a light-emitting device, which comprises a plurality of light-emitting units disposed on a circuit substrate with at least one of the plurality of light-emitting units being damaged. The method for repairing a light-emitting device including the following steps is provided: removing the at least one damaged light-emitting unit from the circuit substrate to form an unoccupied position on the circuit substrate; providing a good light-emitting unit on a bottom of which a volatile adhesive material has been applied; using a pick and place module to place the good light-emitting unit at the unoccupied position on the circuit substrate; and melting and solidifying the volatile adhesive material so that the good light-emitting unit is affixed at the unoccupied position.