Voltage-Switchable Debondable Adhesive for Strong Bonds and Easy Release

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Solution Overview

Problem

There is a long-felt need for a debondable adhesive system that can address imprecise substrate positioning, incorrect substrate bonding, or the need to replace defective substrates, which existing systems have yet to adequately satisfy.

Innovation Solution

A composition comprising ionic liquid-infused particles, where the ionic liquid is made of positively and negatively charged ions, often liquid at room temperature, and a curable component such as (meth)acrylates, epoxies, or siloxanes, which can be debonded by applying a controlled voltage to the bonded substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a strong adhesive bond is formed between substrates, then bonding strength is improved, but debonding becomes difficult and requires excessive force

Engineering Contradiction:
Improvebonding strengthVSAvoiddebonding ease
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The adhesive system changes its bonding parameters through voltage application. At low voltage, the adhesive maintains strong bonding properties. When voltage is applied, the ionic liquid becomes conductive and enables ionic mobility, fundamentally changing the adhesive's electrical properties and reducing bond strength to enable debonding.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The adhesive system transitions from a static strong bond to a dynamic controllable bond. The bonding strength is not fixed but can be dynamically adjusted by applying voltage, allowing the system to switch between bonded and debonded states as needed.

Inventive Principle:
Principle #15Dynamics

2Ease of operation

If a debondable adhesive system is designed, then ease of substrate replacement is improved, but bonding reliability deteriorates

Engineering Contradiction:
Improvesubstrate replacement easeVSAvoidbonding reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The adhesive system operates in periodic cycles of bonding and debonding. During normal operation, the bond remains strong and reliable. When debonding is needed, voltage is applied temporarily to reduce bond strength, allowing substrate replacement, after which normal bonding strength is restored.

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The ionic liquid acts as an intermediary that mediates between the need for strong bonding and easy debonding. It provides ionic conductivity that enables voltage-controlled debonding while maintaining strong adhesive bonding under normal conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If ionic liquid is added to adhesive composition, then debondability is improved, but adhesive stability worsens

Engineering Contradiction:
ImprovedebondabilityVSAvoidadhesive composition stability
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The ionic liquid is not uniformly distributed throughout the adhesive but is localized within porous particles. This local concentration allows the ionic liquid to provide debonding functionality only where needed, while the bulk adhesive maintains its stability and bonding properties.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Porous particles are used as carriers for the ionic liquid. The porous structure allows the ionic liquid to be contained within the particles, preventing it from disrupting the overall adhesive composition while still enabling it to function when voltage is applied.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system allows for efficient and controlled debonding of substrates with reduced force requirements, leaving minimal residual adhesive, and enables reversible bonding with improved debondability.

Implementation Method 1

Applying to the electrically conductive substrates about 3 volts to about 75 volts, such as about 30 volts of DC current from the power supply for a period of time of about 0.1 seconds to about 3 hours

Methodology Applied
Scientific EffectIon migration: Electrophoresis

Data Source

PatentUS20260071101A1Debondable adhesive systems
Publication Date: 2026.03.12 HENKEL KGAA
  • US20260071101A1 patent drawing

AI summary

Provided herein is a debondable adhesive system.