Voltage Detection Circuit with Downstream Chip Beads

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Solution Overview

Problem

Variations in impedance characteristics of chip beads in voltage detection circuits lead to reduced precision in voltage value outputs due to inconsistent voltage drops across input signals, affecting the accuracy of differential amplifiers.

Innovation Solution

A voltage detection circuit design where chip beads are placed downstream of capacitors in the signal lines, ensuring that the voltage drops are minimized and the input impedance of the differential amplifier is larger than the chip beads, thereby reducing the impact of impedance variations on signal processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If chip beads are disposed on signal lines further toward the side of input terminals than capacitors, then noise filtering is improved, but manufacturing precision deteriorates due to impedance variation

Engineering Contradiction:

Improvenoise filteringVSAvoidvoltage detection precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The patent segments the signal line into multiple sections with different components arranged in specific sequences. The first signal line contains a first capacitor connected to the non-inverting input terminal, while the second signal line contains a second capacitor connected to the inverting input terminal. This segmentation allows independent optimization of each signal path to minimize the impact of impedance variations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent inverts the conventional arrangement by placing capacitors before the chip beads in the signal path, rather than after them. This reversal ensures that the capacitors are positioned closer to the amplifier inputs, which stabilizes the voltage difference measurement by reducing the impact of chip bead impedance variations on the differential voltage.

Inventive Principle:

Principle #13The other way round (Inversion)

2Object-affected harmful factors

If chip beads are placed upstream of capacitors, then signal filtering is enhanced, but voltage drop variation increases due to impedance characteristics

Engineering Contradiction:

Improvesignal filteringVSAvoidvoltage difference measurement precision

Core Design Contradiction:

Object-affected harmful factorsVSMeasurement precision

Solution Approach 1:

The capacitors act as intermediary elements between the input terminals and the chip beads. By placing capacitors closer to the amplifier inputs, they serve as mediators that stabilize the voltage signals before they pass through the chip beads, thereby reducing the impact of impedance variations on the measured voltage difference.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If chip beads are positioned closer to input terminals, then noise removal is improved, but current through chip beads increases causing voltage drop

Engineering Contradiction:

Improvenoise removalVSAvoidvoltage drop

Core Design Contradiction:

Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The circuit performs preliminary action by placing capacitors before the chip beads in the signal path. This preliminary placement of capacitors prepares the voltage signals in advance, stabilizing them before they encounter the chip beads, thereby minimizing voltage drops caused by current flow through the chip beads while maintaining noise filtering effectiveness.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration suppresses the reduction in precision of voltage value outputs from the differential amplifier by minimizing voltage drops and current through the chip beads, maintaining signal accuracy despite manufacturing errors in chip bead impedance.

Implementation Method 1

a first capacitor (41) connected in parallel to the first signal line (10); a second capacitor (42) connected in parallel to the second signal line (20)

Methodology Applied

Scientific EffectCapacitance: Capacitance

Implementation Method 2

The chip bead absorbs noise in a high frequency band of the signal, and discharges the absorbed noise in the form of heat

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 3

a first filter element (51) which has an inductor component and a resistor component and is connected in series to the first signal line (10)

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS9164129B2Voltage detection circuit

Publication Date: 2015.10.20 KYB CORP

AI summary

A voltage detection circuit includes: an amplifier which amplifies a voltage difference between first and second input signals input into non-inverting and inverting input terminals of the amplifier via first and second input portions; a first signal line which connects the first input portion to the amplifier; a second signal line which connects the second input portion to the amplifier; a first capacitor connected in parallel to the first signal line; a second capacitor connected in parallel to the second signal line; a first filter element which has an inductor component and a resistor component and is connected in series to the first signal line between the first capacitor and the amplifier; and a second filter element which has an inductor component and a resistor component and is connected in series to the second signal line between the second capacitor and the amplifier.