Voltage Probe Assembly for Accurate Substrate Charging Measurement
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Solution Overview
Problem
Existing voltage measurement technologies fail to accurately estimate substrate charging during semiconductor manufacturing processes, particularly in environments similar to actual substrate etching, leading to measurement errors and distortion.
Innovation Solution
A voltage measurement assembly comprising a support substrate with a voltage measurement probe, including a first electrode, pattern plate, dielectric wall, and second electrode, designed to measure voltage without overlapping the first electrode, allowing for accurate estimation of substrate charging under simulated etching conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing voltage measurement technologies are used, then measurement can be performed, but measurement accuracy is poor due to voltage distortion and inability to simulate actual process substrate conditions
Solution Approach 1:
The patent creates a measurement model substrate that copies the electrical characteristics and structure of an actual process substrate. This includes forming a pattern plate with pattern holes, dielectric layers, and electrode structures that replicate the real substrate's geometry and material properties. By measuring voltage on this copied model rather than the actual substrate, the system achieves accurate voltage measurement without disturbing the real process
Solution Approach 2:
The measurement model substrate acts as an intermediary between the voltage measurement system and the actual process substrate. It transfers the electrical characteristics of the real substrate to a measurable form while isolating the measurement process from the actual manufacturing process. The model substrate includes a first electrode connected to a power supply and a second electrode for measurement, creating an intermediate measurement system that accurately reflects real substrate behavior
2Productivity
If a single voltage measurement probe is used, then device complexity is low, but measurement efficiency is poor as it can only measure one position at a time
Solution Approach 1:
The measurement probe is segmented into multiple independent measurement units, each capable of measuring voltage at different positions on the measurement model substrate. Each unit includes its own second electrode and connection structure. This segmentation allows simultaneous multi-point measurement, dramatically improving productivity while keeping each individual measurement unit relatively simple
Solution Approach 2:
Multiple measurement units are merged into a single integrated measurement probe assembly that can be placed on the measurement model substrate simultaneously. The probe combines multiple second electrodes, connection wires, and measurement circuits into one unified device, enabling concurrent measurement of multiple positions without requiring multiple separate probes or sequential measurements
3Measurement precision
If the second electrode overlaps the pattern plate, then measurement structure is simple, but measurement accuracy deteriorates due to interference with electrical field distribution
Solution Approach 1:
The second electrode is positioned in a specific location that does not overlap with the pattern plate, creating a localized measurement zone free from interference. The electrode is placed in a region where the electrical field distribution is representative of the actual substrate conditions but not distorted by the pattern plate structure. This local quality optimization ensures accurate measurement while maintaining overall structural simplicity
Data Source
AI summary
Disclosed are voltage measurement assemblies and substrate charging measurement methods. The voltage measurement assembly includes a support substrate, and a voltage measurement probe on a top surface of the support substrate. The voltage measurement probe includes a first electrode, a pattern plate, a dielectric wall in contact with a lateral surface of the pattern plate, and a second electrode in contact with the dielectric wall. The pattern plate provides a plurality of pattern holes that are downwardly recessed from a top surface of the pattern plate and vertically extend in the pattern plate. The second electrode does not vertically overlap the first electrode.