Voltage Regulator Module Placement on Interposer

The patent transitions from a planar layout to a three-dimensional stacked architecture where VRMs are positioned vertically above or below circuit blocks through multiple packaging layers. This spatial reconfiguration dramatically reduces horizontal wiring distances while maintaining electrical connectivity, thereby reducing power losses without compromising voltage optimization capabilities.

The patent introduces an interposer as an intermediary substrate that facilitates electrical connections between VRMs and circuit blocks. The interposer acts as a mediator that enables short-distance vertical connections through controlled impedance traces and vias, eliminating the need for long external wiring while maintaining signal integrity and power efficiency.

The patent segments the packaging structure into distinct functional layers: a first packaging layer containing the integrated circuit, a second packaging layer containing the VRM, and an interposer layer providing electrical connections. This segmentation allows physical proximity for low power loss while maintaining electrical isolation to minimize noise coupling between power supply wiring and sensitive circuit blocks.

The patent implements different quality characteristics in different spatial regions: the interposer provides low-inductance power paths locally at the VRM-circuit block interface to minimize power loss, while the vertical stacking arrangement creates natural electromagnetic shielding that reduces noise exposure in sensitive circuit regions. Each layer is optimized for its specific function with appropriate material selection and trace geometry.