Voltage Regulator Module With Embedded Capacitors And U-Shaped Copper
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Solution Overview
Problem
Conventional voltage regulator modules face challenges in effectively transferring heat, withstanding pressure, and efficiently using space for output capacitors, leading to reduced dynamic switching performance and reliability issues due to limited pin distribution density and potential short-circuit problems.
Innovation Solution
The voltage regulator module incorporates a first and second circuit board assembly with U-shaped copper structures for enhanced thermal conductivity and pressure resistance, embedding or encapsulating output capacitors within the second printed circuit board, and using a conduction circuit board with conduction fingers and surface pins for improved signal communication and reduced volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the voltage regulator module is located at the same side of the system board as the central processing unit, then the load dynamic switching requirements can be met, but the electronic device volume cannot be reduced
Solution Approach 1:
The voltage regulator module transitions from a planar layout (same side of system board) to a three-dimensional stacked layout (opposite sides of system board with vertical connections), enabling space reduction while maintaining electrical connection performance for dynamic switching
2Volume of moving object
If the output capacitor is disposed within the voltage regulator module, then the electronic device volume is reduced, but the installation space for output capacitors is restricted
Solution Approach 1:
Output capacitors are embedded within the internal structure of the voltage regulator module, nesting components within components to reduce overall volume while accommodating multiple capacitors through vertical and lateral arrangement within the module's internal space
3Strength
If the voltage regulator module is fixed on the casing through heat sink and spring screws, then the module can be secured, but the heat transfer efficiency is insufficient and pressure resistance is reduced
Solution Approach 1:
The heat dissipation function and mechanical support function are merged into a single integrated structure where the back of the voltage regulator module directly contacts the system board, simultaneously achieving secure fixation and efficient heat transfer through the shared interface
Solution Approach 2:
The system board acts as an intermediary medium that simultaneously provides mechanical support and thermal conduction path, replacing the separate heat sink and screw fixation system with a unified board-mounted solution
4Ease of manufacture
If conventional pin structures are used for signal communication, then the module can be assembled, but the pin distribution density is low and short-circuit problems may occur
Solution Approach 1:
Traditional mechanical pin structures are replaced with integrated circuit board trace connections and surface-mounted contact structures, eliminating mechanical insertion/removal operations while achieving higher connection density and reduced short-circuit risk through precise PCB routing and controlled impedance design
5Volume of moving object
If the voltage regulator module is disposed on the opposite side of the system board from the central processing unit, then the electronic device volume is reduced, but the heat transfer path is extended
Solution Approach 1:
The voltage regulator module is designed with localized heat generation regions that directly interface with high-thermal-conductivity pathways through the system board, creating optimized thermal channels that compensate for the increased distance by concentrating heat flow through high-performance thermal paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation, increases pressure resistance, allows for more output capacitors, and increases pin distribution density, thereby improving dynamic switching performance and reliability while reducing the module's volume and enhancing power density.
Implementation Method 1
The second terminal of the at least one first copper structure and a part of the plurality of ball grid arrays are electrically connected, and the other terminal of the at least one first copper structure and a terminal of the at least one output capacitor are electrically connected
Implementation Method 2
The magnetic core assembly is arranged between the first surface of the first printed circuit board and the first surface of the second printed circuit board. The magnetic core assembly includes a magnetic core portion and at least one first copper structure
Data Source
AI summary
A voltage regulator module includes a first circuit board assembly, a second circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board. The second circuit board assembly includes a second printed circuit board, at least one output capacitor, a plurality of ball grid arrays and at least one bonding pad. The second printed circuit board includes a first surface and a second surface. The plurality of ball grid arrays are disposed on the second surface of the second printed circuit board. The at least one bonding pad is arranged beside the first surface of the second printed circuit board. The magnetic core assembly is arranged between the first circuit board assembly and the second circuit board assembly and electrically connected with the at least one bonding pad. The at least one output capacitor is embedded within the second circuit board assembly.