Voltage Regulator Module With Embedded Magnetic Winding
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Solution Overview
Problem
Conventional voltage regulator modules are thick due to the placement of magnetic elements and switch components on the circuit board, which hinders their integration into thinner electronic devices, especially those requiring increased power density and multi-phase buck circuits.
Innovation Solution
The voltage regulator module design embeds metallic winding assemblies within the circuit board and uses a magnetic core assembly in a vertical clamping manner, reducing height and thickness while maintaining efficiency through lower parasitic resistance and power loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If magnetic elements and switch components are placed on the circuit board in conventional manner, then the voltage regulator module can be manufactured with standard components, but the thickness of the module becomes large
Solution Approach 1:
The patent embeds the magnetic element and switch component within a recess of the circuit board, nesting components inside the board structure rather than placing them on the surface. This nesting approach reduces the overall thickness of the voltage regulator module while maintaining standard manufacturing processes
Solution Approach 2:
The patent transitions from a planar arrangement of components on the circuit board surface to a three-dimensional arrangement by creating a recess and placing components within it. This dimensional change allows components to be embedded rather than mounted, reducing the thickness dimension while preserving electrical connectivity through conductive vias
2Adaptability or versatility
If a multilayered circuit board with planar winding assemblies is used to meet multi-phase buck circuit requirements, then the circuit functionality is achieved, but the thickness of the electronic device increases
Solution Approach 1:
The patent embeds the magnetic element and switch component within a recess of the circuit board, nesting components inside the board structure rather than placing them on the surface. This nesting approach reduces the overall thickness of the voltage regulator module while maintaining standard manufacturing processes
Solution Approach 2:
The patent transitions from a planar arrangement of components on the circuit board surface to a three-dimensional arrangement by creating a recess and placing components within it. This dimensional change allows components to be embedded rather than mounted, reducing the thickness dimension while preserving electrical connectivity through conductive vias
Data Source
AI summary
A voltage regulator module includes a circuit board, a first component and a switching circuit assembly. The circuit board includes a first surface, a second surface, a concave structure and a contact pad. The first surface and the second surface are opposed to each other. The concave structure is disposed in the circuit board and concavely formed on the second surface. The contact pad is formed on the second surface and served as at least one of a positive output terminal, a negative output terminal and a positive input terminal. The concave structure and the contact pad are misaligned to each other. The first component is at least partly disposed within the concave structure. The switching circuit assembly is disposed on the first surface and electrically connected with the contact pad and the first component.


