Multi-phase Voltage Regulator Module with Stacked IMS and FR4 Substrates
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Solution Overview
Problem
Conventional multi-phase synchronous buck voltage regulator modules have inefficiencies in packaging, leading to larger sizes and potential thermal performance issues due to the use of discrete packaged devices and separate substrates for power and driver components.
Innovation Solution
A modular design where power switches are mounted on an insulated metal substrate and captured between this substrate and an FR4 board carrying driver ICs, output capacitors, inductors, and a controller, with a heat spreader for thermal management and scored IMS substrate for controlled heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete packaged devices and separate substrates are used for power and driver components, then ease of manufacture is improved, but module size increases and thermal performance deteriorates
Solution Approach 1:
The patent merges previously separate substrates (IMS and FR4) into a single integrated substrate structure. Power switches are mounted on the IMS substrate while driver ICs are mounted on the FR4 board, which is then bonded to the IMS substrate, creating one unified module structure that reduces overall size while maintaining manufacturing simplicity.
Solution Approach 2:
The patent transitions from a planar arrangement of discrete components to a three-dimensional stacked configuration. Components are arranged in multiple layers (IMS substrate with power switches, FR4 board with driver ICs, output capacitors, inductors, and controller stacked together), effectively utilizing vertical space to reduce the module's footprint.
2Ease of manufacture
If discrete packaged devices and separate substrates are used for power and driver components, then ease of manufacture is improved, but thermal performance deteriorates
Solution Approach 1:
The patent combines the IMS substrate and FR4 board into a single bonded structure with integrated thermal management. The heat spreader is incorporated into this unified structure, allowing efficient thermal pathways from power switches through the IMS substrate to the heat spreader, while maintaining ease of manufacture through standardized bonding processes.
Solution Approach 2:
The patent introduces a heat spreader as an intermediary thermal management component between the power switches on the IMS substrate and the external environment. This heat spreader efficiently conducts and distributes heat, improving thermal performance while integrating seamlessly with the bonded substrate structure.
3Volume of moving object
If components are stacked and bonded between IMS substrate and FR4 board, then module size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the module into distinct functional layers: IMS substrate with power switches, FR4 board with driver ICs, output capacitors, inductors, and controller. Each segment can be prepared and tested independently before final assembly, reducing manufacturing complexity despite the three-dimensional stacked configuration.
Solution Approach 2:
The bonded substrate structure serves multiple functions simultaneously: it provides mechanical support for all components, establishes electrical connections between power switches and driver ICs, and incorporates thermal management pathways. This multi-functionality reduces the need for additional separate components or structures, simplifying the overall manufacturing process.
4Temperature
If heat spreader is integrated with stacked components, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The heat spreader is merged with the bonded substrate structure, forming an integrated thermal management system. The heat spreader is positioned in direct thermal contact with the power switches on the IMS substrate and extends to dissipate heat efficiently, while being structurally integrated with the FR4 board and other components, reducing the need for separate thermal management assemblies.
Solution Approach 2:
The heat spreader serves multiple functions: it conducts heat away from power switches, provides a thermal pathway through the bonded substrate structure, and may serve as a mechanical support element or electrical ground plane. This multi-functionality improves thermal performance without adding significant device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces module size while maintaining thermal performance through efficient component stacking and thermal transfer, offering a more compact and thermally efficient solution compared to conventional packaging methods.
Implementation Method 1
a heat spreader for thermal management and scored IMS substrate for controlled heat transfer
Implementation Method 2
scored IMS substrate for controlled heat transfer
Data Source
AI summary
A voltage regulator module that includes components for a multi-phase converter, the converter including a plurality of power stage elements on one circuit board, a control element, driver elements, and elements for the output stages of the power stage elements on another circuit board.