Voltage Regulator Pad Switching for Single and Double Bonding
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Solution Overview
Problem
Existing semiconductor devices require separate configurations for packages with and without double bonding of the lead frame pad, limiting their applicability and necessitating the production of two distinct types of devices.
Innovation Solution
A semiconductor device design that includes an operational amplifier, output transistor, feedback resistor, and a connection switching element, such as a fuse or PMOS transistor, allowing selective connection of pads to the lead frame pad via bonding wires, enabling adaptation to both types of packages regardless of double bonding capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a voltage regulator is designed with double bonding configuration, then output voltage accuracy is improved, but device complexity increases and cannot be applied to single bonding packages
Solution Approach 1:
The voltage regulator is designed with a universal bonding structure where the feedback resistor can be connected to either one or two bonding wires. The regulator body includes a first pad for single bonding and a second pad for double bonding, allowing the same device to function in both single bonding and double bonding package configurations, thereby achieving multi-functionality and universality across different package types
2Reliability
If separate semiconductor devices are prepared for single bonding and double bonding packages, then each device is optimized for its specific package type, but manufacturing complexity and inventory requirements increase
Solution Approach 1:
A single semiconductor device design incorporates both single bonding and double bonding capabilities through the universal bonding structure with first and second pads. This eliminates the need to manufacture and manage separate device types for different package configurations, simplifying production while maintaining package-specific optimization through selectable bonding arrangements
3Ease of manufacture
If a single semiconductor device configuration is used for both single bonding and double bonding packages, then production complexity is reduced, but achieving accurate voltage regulation in double bonding configurations becomes difficult
Solution Approach 1:
The bonding configuration is made dynamic and selectable rather than fixed. The voltage regulator includes a first pad connected to the output transistor and a second pad that can be selectively bonded to the lead frame, allowing the feedback path to be dynamically adjusted based on whether single bonding or double bonding is implemented. This dynamic configurability enables accurate voltage regulation in both modes while maintaining a single device design
Data Source
AI summary
Provided is a semiconductor device applicable to both types of packages regardless of whether or not double bonding of a lead frame pad is allowed. The semiconductor device includes: an operational amplifier; a feedback resistor; a reference voltage generation circuit; an output transistor; a first pad which is connected to an output terminal of the output transistor, and is to be selectively connected to a lead frame pad by a bonding wire; a second pad to be selectively connected to the lead frame pad by a bonding wire; and a connection switching element provided between the first pad and the second pad. In a case in which the second pad is connected to the lead frame pad by the bonding wire, the connection switching element interrupts connection between the first pad and the second pad.