Voltage Regulator Placement on Motherboard Secondary Side
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Solution Overview
Problem
Conventional voltage regulator component placement on the primary side of a motherboard results in longer loadline lengths and higher impedance, leading to inferior performance and increased cost and complexity due to the need for additional circuit boards.
Innovation Solution
Placing voltage regulator components on the secondary side of the motherboard within the IC's keepout zone, reducing loadline length and impedance, and allowing for better power delivery efficiency and lower operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If voltage regulator components are placed on the primary side of the motherboard, then ease of manufacture is improved, but loadline impedance increases
Solution Approach 1:
The patent applies dimensionality change by moving voltage regulator components from the primary side to the secondary side of the motherboard, utilizing the third dimension (z-axis) through the board thickness. This allows components to be positioned directly beneath the IC device's keepout zone, dramatically reducing loadline length and impedance while maintaining manufacturing simplicity through standard PCB routing techniques.
2Object-affected harmful factors
If voltage regulator components are placed closer to the IC device, then loadline impedance is reduced, but device complexity increases
Solution Approach 1:
The patent segments the motherboard into primary and secondary sides, with the voltage regulator components specifically placed on the secondary side within the keepout zone. This segmentation allows the power delivery network to be optimized independently from the main circuit board layout, reducing loadline impedance without complicating the overall system design or requiring additional daughter modules.
3Object-affected harmful factors
If additional VR daughter modules are used, then loadline impedance is reduced, but device complexity and cost increase
Solution Approach 1:
The patent merges the voltage regulator components directly onto the main motherboard substrate, eliminating the need for separate VR daughter modules. By integrating these components on the secondary side of the same board that carries the IC device, the patent achieves low loadline impedance through direct coupling while simplifying the overall system architecture and reducing component count.
4Ease of operation
If voltage regulator components are placed on the primary side, then ease of operation is improved, but loadline length increases
Solution Approach 1:
The patent utilizes the vertical dimension by placing components on the secondary side of the motherboard, allowing the loadline to traverse through the board thickness rather than laterally across the surface. This dimensional shift dramatically shortens the physical length of the power delivery path while maintaining operational simplicity through standard PCB design practices.
Data Source
AI summary
In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.