Voltage-Temperature Sensor for SerDes Circuits
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Solution Overview
Problem
Conventional integrated circuit devices lack effective thermal sensing capabilities, relying on expensive and difficult-to-scale diode devices for temperature monitoring, which are often absent or inefficiently calibrated, leading to increased costs and manufacturing challenges.
Innovation Solution
A circuit and method for integrated voltage and temperature sensing within integrated circuit devices, utilizing a voltage-temperature (VT) core that integrates sensors with existing manufacturing processes, allowing for efficient measurement of temperature and voltage at multiple locations, compatible with existing technology and scalable for various applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional diode devices are used for temperature sensing, then temperature monitoring capability is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines temperature sensing and voltage sensing functions into a single integrated VT core structure. The sensor circuit shares common components including current mirrors, delay cores, and output logic with the reference generator, eliminating the need for separate diode devices and analog-to-digital converters. This merging reduces device complexity while maintaining temperature monitoring capability.
Solution Approach 2:
The VT core is designed as a multi-functional unit that can perform both temperature sensing and voltage sensing operations. By making the sensing circuit universal, the patent eliminates the need for separate dedicated temperature sensing devices, thereby reducing overall device complexity and manufacturing cost while preserving reliable temperature monitoring.
2Loss of information
If conventional diode devices with analog to digital converters are used, then temperature information can be transmitted, but manufacturing cost and device size increase
Solution Approach 1:
The patent merges the temperature sensing function with the existing voltage sensing infrastructure. The VT core shares current mirrors, delay cores, and output logic with the reference generator, eliminating the need for separate analog-to-digital converters. This integration reduces manufacturing cost while ensuring temperature information is accurately transmitted through the existing digital output mechanisms.
Solution Approach 2:
The patent utilizes the existing voltage sensing circuit architecture as a template for temperature sensing. By copying the proven voltage sensing structure and adapting it for temperature measurement, the patent avoids the need for expensive and complex dedicated temperature sensing circuits, thereby reducing manufacturing cost while maintaining information transmission capability.
3Measurement precision
If multi-point calibration is performed for temperature sensing, then measurement precision improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines temperature sensing and voltage sensing into a single VT core that shares calibration mechanisms. The common current mirrors and delay cores are calibrated together, reducing the overall calibration complexity compared to separate calibration processes for dedicated temperature sensors. This integration maintains measurement precision while reducing manufacturing complexity.
Solution Approach 2:
The universal VT core performs both voltage and temperature sensing with a single calibration process. By making the sensing system multi-functional, the patent eliminates the need for separate multi-point calibration procedures for dedicated temperature sensors, thereby reducing calibration complexity while maintaining measurement precision through the shared calibrated components.
4Reliability
If dedicated temperature sensing devices are integrated, then temperature monitoring capability improves, but ease of manufacture decreases
Solution Approach 1:
The patent merges temperature sensing with the existing voltage sensing circuitry in a unified VT core. This integration allows both functions to be manufactured using the same process and layout techniques, improving ease of manufacture compared to adding dedicated temperature sensing devices. The temperature monitoring capability is maintained through the shared sensing infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and efficient on-chip temperature and voltage monitoring across multiple locations within integrated circuits, reducing manufacturing costs and complexity while maintaining compatibility with existing processes.
Implementation Method 1
a delay core is configured to generate a waveform having an average voltage that is representative of a temperature at the remote sensing site
Implementation Method 2
the sensor circuit is electrically coupled to the VT core and is configured to sense voltage information and/or current information from the remote sensing site and transfer the current information to the reference generator
Data Source
AI summary
The present invention relates generally to integrated circuits. More particularly, the present invention provides a circuit and method for sensing a voltage and/or temperature from an integrated circuit device such as a Serializer/Deserializer (SerDes) integrated circuit device. But it will be recognized that the technique can be used for monitoring other system on chip devices, such as micro-controllers, digital signal processors, microprocessors, networking devices, application specific integrated circuits, and other integrated circuit devices that may desire on-chip temperature and/or voltage sensing capability.