Volume-Elastic Medium Enclosing Micromechanical Sensor Module

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Solution Overview

Problem

Conventional micromechanical components face issues with partial protection of sensor elements, susceptibility to mechanical and chemical damage, and complex fastening mechanisms that can be damaged over time, as well as inadequate protection against external substances.

Innovation Solution

A method utilizing a volume-elastic medium that encloses the sensor module and housing, providing mechanical protection, acting as a frequency filter, and eliminating the need for additional fastening mechanisms by using a medium that changes viscosity and incorporates bubbles for pre-tensioning, ensuring secure enclosure and protection from environmental stresses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a protective layer is applied to the sensor element, then mechanical protection is improved, but the protection is only partial and areas not covered can be easily damaged

Engineering Contradiction:
Improvemechanical damage protectionVSAvoidcomprehensive protection coverage
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent combines multiple functions (protection, fastening, sealing, and frequency filtering) into a single volume-elastic medium. This medium completely encloses the sensor module, providing comprehensive mechanical protection without leaving exposed areas, thus resolving the contradiction between partial protection and comprehensive coverage.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The volume-elastic medium serves multiple functions simultaneously: it protects the sensor module mechanically, fastens the module housing in the external housing, seals against external substances, and filters frequencies. This multi-functionality ensures comprehensive protection while simplifying the overall structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If complex fastening mechanisms are used to fix the sensor module, then secure fastening is improved, but the fastening mechanisms may be damaged during service life

Engineering Contradiction:
Improvefastening securityVSAvoiddamage to fastening mechanisms
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The volume-elastic medium performs the fastening function through its own elastic properties and pre-tensioning, without requiring additional fastening components. The medium adapts to temperature changes and maintains secure fastening throughout the service life, eliminating the need for separate fastening mechanisms that could be damaged.

Inventive Principle:
Principle #25Self-service

3Object-affected harmful factors

If the sensor module is completely enclosed by the medium, then protection from external substances is improved, but access to the sensor module is restricted

Engineering Contradiction:
Improveprotection from external substancesVSAvoidaccess to sensor module
Core Design Contradiction:
Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The patent applies local quality by creating specific access regions in the volume-elastic medium where needed (e.g., for pressure sensors). The medium remains completely enclosing for protection while having localized openings or access paths that allow necessary interactions without compromising overall sealing and protection.

Inventive Principle:
Principle #3Local quality

4Reliability

If additional fastening components are added to the sensor module, then fastening security is improved, but the device complexity increases

Engineering Contradiction:
Improvefastening securityVSAvoidnumber of components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the fastening function into the volume-elastic medium itself, eliminating the need for separate fastening components like screws, clips, or adhesives. The medium's elastic properties and pre-tensioning provide secure fastening while reducing the total component count and simplifying the device structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively protects the sensor module from mechanical and thermal stresses, filters frequencies, and prevents external substance penetration, ensuring reliable operation and extended service life without complex fastening devices.

Implementation Method 1

the medium thus additionally advantageously protects the sensor module during a subsequent injection-molding process to produce the external housing. The pressure arising due to the injection-molding method is advantageously absorbed by the medium

Methodology Applied
Scientific EffectElastic compression: Elasticity

Implementation Method 2

a foam-like elastomer which may change its volume in an elastically reversible way to a larger extent under changing, external mechanical-thermal stresses

Methodology Applied
Scientific EffectVolume elasticity: Elasticity

Implementation Method 3

pre-tensioning of the medium is also preferably caused by the enclosure of the medium inside the external housing. This pre-tension preferably continues to exist throughout the entire service life of the micromechanical component and thus ensures that the sensor module remains permanently enclosed

Methodology Applied
Scientific EffectElastic pre-tension: Elasticity

Data Source

PatentUS8528402B2Micromechanical component having a volume-elastic medium
Publication Date: 2013.09.10 ROBERT BOSCH GMBH
  • US8528402B2 patent drawing
  • US8528402B2 patent drawing

AI summary

A method for manufacturing a micromechanical component is described, the micromechanical component having a medium. The medium has settable and changeable volume-elastic properties and generally completely encloses a sensor module and/or a module housing. The medium preferably has a low-pass response.