In-situ Temperature Compensation Using Vortex Airflow
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Solution Overview
Problem
Conventional methods for temperature compensation of electronic components, such as OCXOs, are costly and inefficient, requiring expensive equipment like Rubidium oscillators or large temperature chambers, which are impractical due to high costs and resource consumption.
Innovation Solution
An in-situ temperature compensation method using a vortex air gun to provide controlled airflow for electronic devices, allowing for the creation of a calibration table by measuring offsets at various temperatures, which can be stored for compensation during operation, utilizing a processor and temperature sensor to match temperature gradients experienced during operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature chambers are used for characterizing electronic components, then temperature compensation data can be obtained, but the process becomes complex, time-consuming, and requires large equipment that consumes power and space
Solution Approach 1:
The patent extracts the temperature characterization function from the complex temperature chamber environment and implements it directly within the electronic component's operational context. By using the component's own temperature sensor and operating environment, the characterization process is simplified while maintaining measurement accuracy.
Solution Approach 2:
The electronic component characterizes its own temperature behavior using its integrated temperature sensor and operational temperature variations. This self-characterization eliminates the need for external temperature chambers and complex test equipment, reducing both device complexity and resource consumption while obtaining accurate compensation data.
2Reliability
If expensive oscillators like Rubidium are used for temperature compensation, then performance variation with temperature is reduced, but the cost increases significantly
Solution Approach 1:
The patent uses inexpensive standard oscillators combined with software-based temperature compensation tables instead of expensive Rubidium oscillators. The compensation data, once obtained through self-characterization, provides reliable temperature stability at a fraction of the cost of premium oscillators.
Solution Approach 2:
The patent changes the approach from hardware-based temperature stability (expensive oscillators) to software-based compensation (inexpensive oscillators with calibration tables). By measuring and storing frequency-temperature relationships, the system achieves reliable temperature compensation through parameter correction rather than hardware precision.
3Measurement precision
If temperature characterization is performed in large chambers, then comprehensive temperature data can be collected, but space and power consumption increase
Solution Approach 1:
The patent extracts the temperature characterization function from large external temperature chambers and implements it within the electronic component itself using its integrated temperature sensor. This eliminates the need for large equipment while maintaining comprehensive temperature data collection across the operating range.
4Measurement precision
If conventional temperature chambers are used for characterization, then temperature compensation data can be obtained, but the process is time-consuming
Solution Approach 1:
The electronic component performs self-characterization using its own temperature sensor and operational temperature variations, eliminating the time-consuming process of external chamber testing. The component autonomously measures its frequency response across temperatures and generates its own compensation table, significantly improving productivity while maintaining calibration accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the need for expensive external equipment, enables efficient and accurate characterization of electronic components, and allows for temperature compensation in-situ, reducing production costs and time while maintaining accuracy.
Implementation Method 1
providing airflow from a vortex air gun to a board including the electronic device and the associated temperature sensor
Implementation Method 2
the various temperatures are measured by the associated temperature sensor
Data Source
AI summary
An in-situ temperature compensation method of an electronic device and an associated temperature sensor includes providing airflow from a vortex air gun to a board including the electronic device and the associated temperature sensor; determining an associated offset at various temperatures in an operating range; and creating and storing a calibration table in memory including the associated offsets at the various temperatures, the calibration table is used during operation of the electronic device for compensation due to temperature variation. A system includes a board, an electronic device disposed to the board; a temperature sensor disposed on the board; a processor disposed to the board and communicatively coupled to the electronic device and the temperature sensor; and instructions that cause the processor to determine an associated offset at various temperatures in an operating range, and create and store a calibration table in memory with the associated offsets at the various temperatures.