Vortex Coolant Evaporator for Low-Pressure Electronic Cooling
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Solution Overview
Problem
Existing cooling apparatuses for electronic devices are inadequate in managing the increased heat generated by high-performance semiconductor components, particularly in smaller portable devices, as they fail to effectively discharge heat due to limitations in cooling performance and pressure loss during coolant circulation.
Innovation Solution
A cooling apparatus that introduces vortical coolant into an evaporator using a condenser, vaporizer, venturi tube, and injecting unit, where the coolant is vaporized by an auxiliary heat source, formed into a vortex, and then injected along a spiral trajectory to enhance heat exchange with the main heat source, minimizing pressure loss and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing cooling apparatus with cooling fan or heat pipe is used, then the structure is simple, but the cooling performance is insufficient for high-performance semiconductor components generating over 35 W heat
Solution Approach 1:
The cooling apparatus is divided into distinct functional modules: vaporizer unit with porous material, venturi tube for pressure reduction, injecting unit with vortex generator, and evaporator. Each module performs a specific function in the coolant circulation process, allowing for optimized heat exchange while maintaining manageable system complexity
Solution Approach 2:
The system utilizes phase transition of coolant between liquid and vapor states. The coolant is vaporized in the vaporizer unit through heat exchange with the heat source, then condensed in the condenser, creating a continuous phase change cycle that efficiently transfers heat from the semiconductor component
2Loss of energy
If coolant is circulated through existing cooling apparatus, then the system operates continuously, but pressure loss occurs during circulation reducing efficiency
Solution Approach 1:
The venturi tube utilizes hydraulic principles to reduce coolant pressure before injection. The converging-diverging geometry creates a pressure differential that accelerates the coolant flow, reducing pressure loss during circulation and improving overall system efficiency
Solution Approach 2:
The vortex is generated in advance in the injecting unit before the coolant enters the evaporator. This preliminary vortex formation ensures optimal contact between coolant and evaporator surface from the moment of entry, maximizing heat exchange efficiency throughout the circulation cycle
3Temperature
If coolant flows directly through evaporator without vortex formation, then the flow path is simple, but heat exchange effectiveness is reduced
Solution Approach 1:
The vortex generator creates a spiral, curved flow path within the evaporator instead of straight linear flow. This curved trajectory increases the contact time and contact area between coolant and evaporator surface, significantly enhancing heat exchange effectiveness
Solution Approach 2:
The vortex acts as an intermediary mechanism that mediates heat transfer between the coolant and evaporator. By introducing rotational motion, the vortex enhances mixing and contact between phases, improving the overall heat exchange process without requiring direct modification of the evaporator geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus significantly enhances cooling performance by promoting effective heat exchange between the vortical coolant and the main heat source, reducing pressure loss, and improving the overall cooling efficiency in electronic devices.
Implementation Method 1
a venturi tube allowing the coolant passing through the vaporizer to be spouted with low pressure
Implementation Method 2
an injecting unit positioned in a spouting port of the venturi tube, the injecting unit causing the coolant passing through the venturi tube to move along a spiral trajectory and to be formed into a vortex
Implementation Method 3
an evaporator allowing heat exchange between the coolant spray and a main heat source located outside of the evaporator
Implementation Method 4
a condenser for condensing a coolant
Implementation Method 5
a vaporizer having a vaporizing unit, the coolant passing through the condenser being introduced into the vaporizing unit and vaporized by heat exchange with an auxiliary heat source provided outside of the vaporizing unit
Data Source
AI summary
The present invention relates to a cooling apparatus for an electronic device. In the present invention, a coolant passing through a condenser 10 is introduced into and s filled in a compensator 15. The coolant passing through the compensator15 is introduced into a vaporizer 20 and vaporized through heat exchange with an auxiliary heat source H2 provided outside of the vaporizer. In addition, a vaporizing unit 22 made of a porous material is provided in the vaporizer 20. The coolant passing through the vaporizer 20 and a liquid coolant supplied from the condenser 10 are mixed in a vortex generating unit 30 to form a coolant spray, and the coolant spray moves along a spiral trajectory to be formed into a vortex. Meanwhile, the coolant spray of a vortex is injected to be in close contact with the inner wall of an evaporator 50 to be heat-exchanged with a main heat source H1 positioned outside of the evaporator, thereby cooling the main heat source H1. According to the present invention as mentioned above, the main heat source adjacent to the evaporator is heat-exchanged with the coolant more actively to thereby improve the cooling performance of the electronic device. Also, a pressure loss of the coolant spouted from the venturi tube is further reduced.