Vortex-Flow Cooling Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing cooling devices for semiconductor chips face challenges in reducing size while maintaining effective heat conductivity and minimizing pressure loss, as they often rely on heat dissipation members that extend away from the component, limiting their compactness and efficiency.
Innovation Solution
A cooling structure with a vortex-flow generating portion that extends in a direction intersecting the circulation of the cooling fluid, featuring grooves with specific dimensions and shapes to promote vortex flow, enhancing heat transfer while reducing pressure loss and simplifying the design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation members are extended in the direction away from the electronic component to increase flow contact area, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The patent applies curvature by forming vortex-generating concave portions in the cooling plate surface. These curved geometric features create rotational vortex flow patterns in the cooling fluid, enhancing heat transfer efficiency without requiring extended heat dissipation members, thus improving heat dissipation while maintaining compact device size
2Volume of moving object
If cooling structure is compacted to reduce size, then device miniaturization is achieved, but pressure loss increases
Solution Approach 1:
The vortex-generating concave portions with curved geometries create rotational flow that enhances mixing and heat transfer efficiency. This allows the cooling structure to be more compact while maintaining effective cooling performance, reducing the need for large flow paths that would increase pressure loss in miniaturized devices
3Temperature
If conventional cooling structures are used to maintain heat conductivity, then cooling efficiency is preserved, but device complexity increases
Solution Approach 1:
The patent merges the cooling plate with vortex-generating concave portions directly into a single integrated component. This integration eliminates the need for separate vortex-generating elements or complex heat dissipation members, simplifying the overall device structure while maintaining effective heat conductivity through the vortex flow mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vortex-flow generating portion effectively improves heat conductivity and reduces pressure loss, allowing for a more compact and efficient cooling system by generating vortex flows that enhance heat transfer and minimize pressure increase.
Implementation Method 1
a vortex-flow generating portion provided in a base material with a heat generating element disposed thereon and extending in a direction intersecting a circulation direction of cooling fluid, and adapted to generate a vortex flow depending on a flow rate of the cooling fluid
Implementation Method 2
cooling fluid flowing inside the water jacket and a base material with the heat generating element disposed thereon... adapted to cool the heat generating element
Data Source
Figure 1
Figure 2(A)~2(B)
Figure 3
AI summary
The present invention relates to a cooling structure for cooling a heat generating element 30 by allowing cooling fluid to circulate around the heat generating element 30 or a base material 22 with the heat generating element 30 disposed thereon, wherein the cooling structure is provided with a vortex-flow generating portion C1, which extends in a direction β intersecting a circulation direction α of the cooling fluid, and which generates a vortex flow depending on the flow rate of cooling fluid.