Vortex Generators Embedded in Guide Rail Plates for PCB Cooling
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Solution Overview
Problem
Current cooling solutions for telecommunication systems, such as those using metal heat sinks and fans, face challenges with increasing thermal loads and densities, leading to inadequate cooling, reliability issues, noise problems, and increased operational expenses due to the need for higher fan power and airflow, which compromises heat transfer and component reliability.
Innovation Solution
Incorporating vortex generators with wing designs embedded in the guide rail plates of printed circuit boards to enhance heat transfer by creating unsteady fluid flow and mixing, reducing thermal resistance without significant pressure drop penalties and maintaining board layout integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If fans are operated at higher power to increase airflow rate for cooling, then heat transfer is improved, but fan reliability decreases and noise increases above regulated levels
Solution Approach 1:
The patent changes the flow regime parameter by introducing vortex generators that create unsteady, rotational flow patterns. This transforms the laminar or simple turbulent flow into a more effective vortex-driven flow that enhances heat transfer coefficients without requiring increased fan power, thus maintaining fan reliability while improving cooling.
Solution Approach 2:
The patent replaces the mechanical solution of increasing fan power with a passive fluid dynamic solution using vortex generators. Instead of relying on higher mechanical energy input from fans, the system uses geometric features to naturally generate vortices that enhance heat transfer, substituting mechanical power increase with structural flow control.
2Temperature
If fans are operated at higher power to increase airflow rate, then heat transfer is improved, but acoustic noise increases above the regulated 65 dBa level
Solution Approach 1:
The patent changes the flow characteristics by introducing rotational vortex flow patterns through embedded wings. This parameter change in flow structure enhances convective heat transfer efficiency, allowing the system to achieve better cooling performance without increasing fan power and thus maintaining noise levels below the 65 dBa regulatory threshold.
3Temperature
If heat sink size is increased to improve heat transfer, then cooling performance is improved, but board density and device compactness are reduced
Solution Approach 1:
The patent changes the heat transfer mechanism by introducing vortex flow that enhances the convective heat transfer coefficient. This parameter change in flow dynamics allows for more effective heat removal from compact heat sinks, improving cooling performance without increasing heat sink volume and preserving board density and device compactness.
4Temperature
If vortex generators are added to enhance heat transfer, then heat transfer is improved, but device complexity increases
Solution Approach 1:
The patent merges the vortex generator function with the existing guide rail structure by embedding wings into the guide rail. This integration combines two structural elements into one, adding vortex generation capability without creating a separate cooling device component, thus minimizing the increase in device complexity while still achieving enhanced heat transfer.
Solution Approach 2:
The guide rail structure serves multiple functions: it provides mechanical support for the printed circuit board and simultaneously acts as a vortex generator through embedded wings. This multi-functionality reduces the need for additional dedicated cooling components, thereby limiting the increase in device complexity while achieving improved heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of vortex generators improves heat transfer efficiency, reduces fan power consumption and noise, and enhances component reliability by optimizing airflow, thereby addressing the limitations of existing cooling solutions.
Implementation Method 1
by adding one or more vortex generators into the fluid flow the heat transfer is considerably improved
Implementation Method 2
As forced convection is used for heat removal, a compromise is necessary between air flow rate, heat sink size and board density
Data Source
Figure 1a~1b
AI summary
A cooling device for a telecommunication system with a board guide rail plate whereof each guide rail (R00A/R00B; R01A/R01B; R14A/R14B) is adapted to receive an edge of a printed circuit board. The cooling device comprises vortex generators (V11A - V17A; V11B - V17B) embedded on the guide rails preferably under the form of delta wings. Propelling an airflow on the vortex generators in the direction of the board improves heat transfer on this board which in turn improves component reliability. The vortex generators on the board guide rails also improve the acoustic noise and fan power consumption owing to the fact that with the enhanced heat transfer there is no longer the same demand on the fans.