Vortex Tube Cleaning Semiconductor Precursor Lines
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Solution Overview
Problem
Existing methods for maintaining semiconductor production tools are inefficient in removing precursor chemical deposits from gas lines and component internals, leading to particle spec failures and wafer product damage.
Innovation Solution
A system comprising a precursor source, a process chamber, a precursor line, and a cleaning device with a vortex tube, where the hot end of the vortex tube is connected to the precursor line to execute a precursor line clean using a hot gas stream.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If state-of-the-art cleaning techniques are used to remove precursor chemical deposits, then particle spec compliance is achieved, but maintenance time becomes excessively long
Solution Approach 1:
The patent applies parameter changes by introducing a heating element that raises the temperature of the precursor line to approximately 100°C. This temperature parameter change causes the precursor chemical deposits to evaporate and be removed from the gas line, achieving particle spec compliance while significantly reducing maintenance time compared to traditional cleaning methods
Solution Approach 2:
The patent replaces mechanical cleaning techniques with a thermal-based approach. Instead of using mechanical means to physically remove deposits, the system uses heat to evaporate the precursor chemicals, allowing them to be cleared from the precursor line through phase change rather than mechanical action
2Productivity
If precursor chemical deposits are allowed to accumulate in the gas line, then maintenance time is reduced, but particle spec failures occur causing wafer product damage
Solution Approach 1:
The patent implements preliminary action by incorporating a heating element that proactively prevents precursor chemical deposits from accumulating in the precursor line. By maintaining elevated temperature, the system keeps precursor chemicals in vapor phase, preventing condensation and deposit formation before they can cause particle spec failures
Solution Approach 2:
The heating element operates continuously or periodically to maintain the precursor line temperature, ensuring continuous prevention of precursor chemical deposition. This continuous thermal action eliminates the need for periodic shutdowns for maintenance cleaning, maintaining both productivity and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently removes particulate contaminants from the precursor line, reducing maintenance time and ensuring particle spec compliance, thereby preventing wafer product damage.
Implementation Method 1
a cleaning device with a vortex tube, where the hot end of the vortex tube is connected to the precursor line to execute a precursor line clean
Implementation Method 2
cleaning the precursor line by providing, via the vortex tube, a hot gas stream to the precursor line, thereby at least partially removing the particulate contaminant from the precursor line
Data Source
AI summary
Methods and related systems that can be useful in the field of semiconductor processing equipment. Methods as disclosed herein can comprise cleaning a precursor line with a hot gas stream emanating from a hot end of a vortex tube.