VRM Heat Dissipation via Bottom-Mounted Inductor and Wave Pins
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Solution Overview
Problem
As electronic circuits such as Voltage Regulator Modules (VRMs) move towards higher frequencies and miniaturization, the proximity to processors increases heat dissipation challenges, potentially affecting processor operations due to parasitic noise interference and heat transfer.
Innovation Solution
The design incorporates a circuit board with electronic devices on the top surface, a power inductor on the bottom, and wave pins with recesses on a copper pillar, along with a heat sink and electroplated metal layers for enhanced heat dissipation, and uses insert-molded pins for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the VRM is moved closer to the processor to reduce parasitic noise interference, then the noise interference is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The VRM package is divided into separate functional regions: electronic devices on the top surface of the circuit board and the inductor on the bottom surface, with wave pins extending through the board to provide both electrical connection and thermal pathways. This segmentation allows independent optimization of each region for its specific function while maintaining close proximity to the processor.
Solution Approach 2:
The wave pins serve as intermediary elements that simultaneously provide electrical connection between the inductor and external circuits, and thermal conduction pathways from the inductor to the package exterior. The copper pillars with recesses create enhanced thermal interface areas that act as mediators between the inductor and heat dissipation structures.
2Volume of moving object
If the VRM is miniaturized to reduce size, then the footprint is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The design transitions from two-dimensional heat dissipation (surface mounting) to three-dimensional heat management by extending wave pins through the circuit board and using copper pillars with recesses that create vertical thermal pathways. This allows heat to be conducted in the Z-direction (through the board thickness) rather than only laterally, enabling effective heat dissipation from a compact footprint.
Solution Approach 2:
The package utilizes composite construction combining the circuit board substrate, copper pillars, wave pins, and molding compound to create multiple thermal conduction pathways. The different materials are strategically positioned to form a thermal network that maximizes heat dissipation efficiency within the minimized package volume.
3Temperature
If more heat dissipation structures are added to the VRM, then the heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The wave pins perform multiple functions simultaneously: they provide electrical connection between the inductor and external circuits, serve as thermal conduction pathways, and act as mechanical support structures. The copper pillars with recesses similarly provide both electrical connection and enhanced thermal interface areas, eliminating the need for separate dedicated thermal vias or heat sinks in some configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the heat dissipation capability of the VRM, minimizing the impact on adjacent components like processors while maintaining a compact size.
Implementation Method 1
a heat sink is disposed over the plurality of electronic devices
Implementation Method 2
a heat sink is disposed over the plurality of electronic devices
Implementation Method 3
a metal layer is electroplated on a top surface of the first MOSFET and a top surface of the second MOSFET, for dissipating heat generated by the first MOSFET and the second MOSFET
Implementation Method 4
each wave pin comprises a conductive body and at least one recess on a bottom surface of the conductive body, wherein the inductor is electrically connected to a wave pin
Data Source
AI summary
An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.