VTFET Bottom Spacer Layer for Gate Junction Control

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Solution Overview

Problem

Existing vertical transport field effect transistors (VTFETs) face challenges in achieving uniformity in the positioning of the gate structure junction and suffer from increased parasitic capacitance between the gate and bottom source/drain, which affects device performance.

Innovation Solution

The method involves forming vertical fins on a substrate with a fin transition region, a gap layer segment, and a bottom spacer layer, along with a gate dielectric and conductive gate layer, to control the offset distance and placement of the gate structure, reducing parasitic capacitance and enhancing uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the gate structure is positioned closer to the bottom source/drain to improve device performance, then the parasitic capacitance increases, but if it is positioned farther away, then the device performance decreases

Engineering Contradiction:
Improvedevice performanceVSAvoidparasitic capacitance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a bottom spacer layer as an intermediary element positioned between the gate structure and the bottom source/drain. This spacer layer acts as a mediator that physically separates the gate from the source/drain region, thereby reducing parasitic capacitance while still allowing the gate to control the channel effectively. The spacer layer is formed with a specific thickness to optimize the balance between capacitance reduction and device performance.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extends the gate structure vertically by adding the bottom spacer layer, creating a multi-dimensional gate configuration. Instead of only adjusting the horizontal position of the gate, the solution introduces a vertical dimension through the spacer layer, allowing the gate to extend into the spacer gap region. This dimensional extension enables better control over the electric field distribution and parasitic capacitance without compromising the gate's control over the channel.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If the gate junction positioning is adjusted to optimize device characteristics, then manufacturing complexity increases, but uniformity improves

Engineering Contradiction:
Improvegate junction positioning uniformityVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the gate structure into two distinct parts: the main gate layer and the bottom spacer layer. This segmentation allows each component to be optimized independently for its specific function. The bottom spacer layer can be precisely controlled in thickness and position to ensure uniform gate junction positioning across different devices, while the main gate layer maintains its primary control function. This segmentation simplifies the manufacturing process by allowing sequential formation and optimization of each segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent forms the bottom spacer layer as a preliminary structure before completing the gate formation process. This preliminary action establishes a reference framework that guides subsequent gate positioning and ensures uniformity. By pre-forming the spacer layer with controlled dimensions, the patent creates a template that automatically ensures consistent gate junction positioning across multiple devices, reducing the need for complex post-processing adjustments.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11538939B2Controlled bottom junctions
Publication Date: 2022.12.27 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US11538939B2 patent drawing
  • US11538939B2 patent drawing
  • US11538939B2 patent drawing

AI summary

A method of forming a vertical transport field effect transistor (VTFET) is provided. The method includes forming one or more vertical fins on a substrate, wherein there is a fin transition region between each of the one or more vertical fins and the substrate. The method further includes forming a sidewall liner having a first thickness on each of the one or more vertical fins. The method further includes forming a sidewall spacer having a second thickness on each of the sidewall liner(s), wherein the first thickness of the sidewall liner and the second thickness of the sidewall spacer determines an offset distance from each of the one or more vertical fins. The method further includes forming a trench with an edge offset from each of the one or more vertical fins by the offset distance.