W-Shaped Chip Package Frame for Dual-Sided Heat Dissipation
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Solution Overview
Problem
The assembly process of dual-sided heat dissipation chip packages is complex compared to single-sided packages, and there is a need for improved heat dissipation in compact chip packaging to manage the increasing heat generated by higher power usage in smaller devices.
Innovation Solution
A method involving a frame with increased surface area is bonded to one or more dies, molded using upside and downside mold dies, and singulated to expose heat sinks, providing structural strength and electrical conductivity while simplifying the packaging process by eliminating additional polishing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If dual-sided heat dissipation structure is used, then heat dissipation performance is improved, but assembly process complexity increases
Solution Approach 1:
The patent combines the frame structure with integrated heat sinks into a single unified component that is bonded directly to the die. This merging eliminates the need for separate assembly steps for attaching heat sinks, thereby maintaining dual-sided heat dissipation performance while simplifying the overall assembly process compared to traditional multi-component dual-sided heat dissipation structures.
Solution Approach 2:
The frame serves multiple functions simultaneously: it provides structural support for the die, acts as an electrical conductor for signal transmission, and functions as a heat dissipation structure through integrated heat sinks on both sides. This multi-functionality reduces the number of separate components needed, thereby simplifying the assembly process while maintaining effective dual-sided heat dissipation.
2Temperature
If frame with increased surface area is used, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The frame with increased surface area and integrated heat sinks is pre-formed as a single component before bonding to the die. This preliminary fabrication of the complex frame structure allows for optimized heat dissipation geometry to be created in advance using specialized manufacturing processes, rather than attempting to assemble complex heat dissipation features during the chip packaging process itself.
Solution Approach 2:
The frame's surface area and geometric parameters are specifically optimized during its fabrication to maximize heat dissipation efficiency. By changing the physical parameters of the frame (increased surface area, specific geometric configurations of heat sinks), the manufacturing process creates a component that achieves superior thermal performance while the integrated design simplifies subsequent assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation and electrical conductivity, simplifies the packaging process, and reduces costs by eliminating the need for additional polishing, while maintaining structural integrity and efficient thermal management.
Implementation Method 1
The frame provides compression strength to the silicon chip package when the one or more dies are bonded
Implementation Method 2
electrically conductivity between for the one or more dies to leads of silicon chip package
Implementation Method 3
The frame provides dual sided heat dissipation for the chip package
Data Source
AI summary
System, method, and silicon chip package for providing structural strength, heat dissipation and electrical connectivity using “W” shaped frame bonded to the one or more dies, wherein the “W” shaped frame provides compression strength to the silicon chip package when the one or more dies are bonded, and electrically conductivity between for the one or more dies to leads of silicon chip package, and heat dissipation for the silicon chip package.