Wafer Adaptor Ring Assembly for Multi-Size Plasma Dicing
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Solution Overview
Problem
The high cost and long lead time associated with purchasing separate plasma chambers for different wafer sizes in semiconductor processing, as well as the inefficiencies of mechanical sawing which can cause cracking and slow throughput, necessitate a solution for adapting wafers of varying sizes within existing plasma processing systems.
Innovation Solution
The development of wafer adaptors comprising a primary ring and an adaptor ring with an adhesive sheet, allowing for the secure mounting and processing of different sized wafers within a single plasma etch chamber, thereby eliminating the need for multiple plasma chambers and reducing the risk of cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a plasma chamber is purchased for each wafer size, then processing capability for specific wafer size is ensured, but cost and lead time increase significantly
Solution Approach 1:
The plasma chamber is designed to process multiple wafer sizes (e.g., 200mm and 300mm) through the use of interchangeable adapter rings. The adapter rings allow the same plasma chamber to accommodate different wafer dimensions, eliminating the need for separate dedicated chambers for each wafer size and reducing overall system complexity.
Solution Approach 2:
Smaller adapter rings are nested within the plasma chamber, allowing smaller wafers to be processed in a chamber designed for larger wafers. The adapter rings fit concentrically within the chamber, creating a nested configuration that enables multi-size compatibility without requiring separate chambers.
2Productivity
If mechanical sawing is used for dicing, then separation of dies is achieved, but processing time increases and cracking may occur
Solution Approach 1:
The mechanical sawing process is replaced with plasma etching for dicing. Instead of using mechanical blades to cut the wafer, plasma is used to etch and separate the dies. This substitution eliminates mechanical contact and vibration that cause cracking, while significantly improving dicing throughput and efficiency.
3Adaptability or versatility
If adapter ring is added to accommodate smaller wafers, then wafer size adaptability is improved, but device complexity increases
Solution Approach 1:
The system is segmented into modular components: the plasma chamber, adapter rings, and wafer holders. Each adapter ring is a separate, interchangeable component that can be quickly swapped depending on the wafer size required. This segmentation allows for easy adaptation without permanently modifying the plasma chamber structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables cost savings by allowing the use of existing plasma chambers for various wafer sizes, improving processing throughput, and reducing the likelihood of wafer cracking, while maintaining the efficiency of plasma dicing.
Implementation Method 1
The ring assembly also includes an adhesive sheet. The adhesive sheet is attached to a bottom adaptor ring surface and is disposed in the adaptor ring opening.
Implementation Method 2
Plasma dicing entails mounting a wafer onto a wafer ring and inserting the wafer ring with the wafer into a plasma chamber for etching.
Data Source
AI summary
A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by the plasma, an adhesive sheet attached to a bottom surface of the primary wafer ring, and an adapted sized wafer disposed on the adhesive sheet between the primary wafer ring and the adapted sized wafer. A method for forming the wafer adaptor ring assembly is also disclosed.