Two-Layer Wafer Temporary Adhesive for Heat-Resistant Clean Peeling
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Solution Overview
Problem
Existing temporary adhesive materials for wafer processing lack stability, peelability, and cleanability, are unsuitable for high-temperature processes, and struggle with uniform film thickness on substrates with large step heights, hindering efficient TSV formation and wafer backside wiring.
Innovation Solution
A two-layered temporary adhesive material comprising a thermoplastic resin layer and a thermosetting siloxane polymer layer, which provides stable adhesion, easy peelability, and excellent cleanability, even on substrates with large step heights, and withstands high-temperature processes like CVD.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermosetting silicone resin is used as a temporary adhesive material layer, then heat resistance and chemical resistance are improved, but peelability deteriorates and cleaning time increases
Solution Approach 1:
The temporary adhesive material layer is divided into two distinct layers: a lower layer (a) made of thermoplastic resin that provides easy peelability, and an upper layer (b) made of thermosetting silicone resin that provides heat and chemical resistance. This segmentation allows each layer to perform its specific function optimally without compromising the other.
2Reliability
If a three-layer structure with thermosetting siloxane polymer layer is used, then adhesion stability is improved, but workability and cleaning time deteriorate
Solution Approach 1:
The invention extracts and removes the problematic thermosetting siloxane polymer layer (layer B) from the adhesive structure, retaining only the beneficial thermoplastic resin layer (layer A) for peeling. This eliminates the workability and cleaning issues associated with thick thermosetting polymer residue while maintaining adhesion stability through the optimized two-layer structure.
3Speed
If high-intensity light irradiation is used to decompose the adhesive material layer, then peeling speed is improved, but equipment cost and processing time increase
Solution Approach 1:
The invention replaces the complex optical decomposition system (laser equipment) with a simple thermal peeling system. The thermoplastic resin layer naturally softens and peels easily when heated to its melting point, eliminating the need for expensive laser equipment while achieving efficient peeling through straightforward thermal processing.
4Ease of operation
If thermally fusible hydrocarbon-based compounds are used in adhesive material, then ease of control is improved, but thermal stability deteriorates at high temperatures
Solution Approach 1:
The invention creates a composite adhesive structure where the lower layer uses thermoplastic resin (easily controllable through heating) and the upper layer uses thermosetting silicone resin (highly thermally stable). This composite structure combines the ease of thermal control with high-temperature stability, allowing the adhesive to be easily manipulated during processing while maintaining reliability in high-temperature environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances wafer processability, facilitates easy peeling and residue removal, and supports uniform film formation, improving the productivity of thin wafers by ensuring high process compatibility with TSV formation and wafer backside wiring.
Implementation Method 1
a first temporary adhesive layer including a thermoplastic resin layer (A) capable of peelably adhering to the front side of the wafer
Implementation Method 2
a second temporary adhesive layer including a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer
Implementation Method 3
capable of peelably adhering to the front side of the wafer
Data Source
Figure 1
AI summary
The present invention is a temporary adhesive material for wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming surface on a front side and a backside to be processed, including a composite temporary adhesive material layer having a two-layered structure that includes a first temporary adhesive layer including a thermoplastic resin layer (A) capable of peelably adhering to the front side of the wafer, and a second temporary adhesive layer including a thermosetting siloxane polymer layer (B) laminated on the first temporary adhesive layer. Accordingly, the present invention provides a temporary adhesive material for wafer processing that has, irrespective of the surface treatment of the wafer substrate, stable wafer processability, excellent peelability of the support, and easy cleaning removability of the temporary adhesive material layer after peeling of the support, can be formed with uniform film thickness even on a substrate with a large step height, exhibits high process compatibility with TSV formation and wafer backside wiring processes, and furthermore exhibits excellent resistance to wafer thermal processes such as chemical vapor deposition (CVD), thereby enhancing the productivity of thin wafers.