Semiconductor Wafer Adhesive Composition for Filling and Clean Removal
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Solution Overview
Problem
Conventional adhesive compositions with (meth)acrylic copolymers, such as those made from butyl (meth)acrylate, have insufficient filling properties for irregular surfaces and tend to leave adhesive deposits when removed, while those made from 2-ethylhexyl (meth)acrylate are easily torn and not removable.
Innovation Solution
An adhesive composition containing a (meth)acrylic copolymer with a structural unit derived from n-heptyl (meth)acrylate, having a carbon-carbon double bond in the side chain, and optimized proportions and properties to enhance filling and removability, including bio-derived carbon content, is developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If acrylic adhesives containing (meth)acrylic copolymers mainly made of butyl (meth)acrylate are used, then adhesion is excellent, but filling properties for irregularities are insufficient
Solution Approach 1:
The patent changes the chemical parameter of the adhesive composition by using n-heptyl (meth)acrylate with a specific carbon chain length and introducing carbon-carbon double bonds in the side chain. This parameter change enables the adhesive to achieve both excellent adhesion and superior filling properties for irregularities, resolving the contradiction between strength and manufacturing precision.
2Manufacturing precision
If acrylic adhesives containing (meth)acrylic copolymers mainly made of 2-ethylhexyl (meth)acrylate are used, then filling properties for irregularities are excellent, but removability is poor and adhesive deposits remain
Solution Approach 1:
The patent introduces carbon-carbon double bonds in the side chain of the (meth)acrylic copolymer, which fundamentally changes the chemical structure and enables curability. This parameter change allows the adhesive to maintain excellent filling properties while achieving easy removability without adhesive deposits after curing, resolving the contradiction between manufacturing precision and ease of operation.
3Strength
If conventional acrylic adhesives are used for temporarily fixing semiconductor wafers, then adhesion is maintained, but removability without adhesive deposits cannot be achieved
Solution Approach 1:
The patent applies preliminary action by introducing curable functional groups (carbon-carbon double bonds) into the adhesive composition before use. This allows the adhesive to be applied and positioned with excellent adhesion, then cured to lock the position, and finally removed cleanly without adhesive deposits by controlling the curing state. The preliminary incorporation of curable functionality enables the complete cycle of bonding, fixing, and clean removal.
Solution Approach 2:
The patent changes the chemical parameter of the adhesive by incorporating n-heptyl (meth)acrylate with carbon-carbon double bonds in the side chain. This parameter change enables the adhesive to achieve excellent adhesion during temporary fixing, maintain stability during processing, and allow clean removal without adhesive deposits, resolving the contradiction between strength and object-generated harmful factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves excellent filling properties for irregular surfaces and easy removability without leaving adhesive deposits, with improved flexibility and cohesion, and can be cured by light or heat for easy removal.
Implementation Method 1
the (meth)acrylic copolymer having a carbon-carbon double bond in a side chain
Implementation Method 2
can be cured by light or heat for easy removal
Data Source
AI summary
The present invention aims to provide an adhesive composition that can achieve both excellent filling properties for irregularities and excellent removability. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition. The present invention also aims to provide a method for processing a semiconductor wafer using the adhesive tape and a method for producing a semiconductor device using the adhesive tape. Provided is an adhesive composition containing a (meth)acrylic copolymer, the (meth)acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate, the (meth)acrylic copolymer having a carbon-carbon double bond in a side chain.