Wafer Processing Adhesive Film with Photosensitive Gas Agent
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Solution Overview
Problem
The existing wafer processing films face challenges in maintaining optimal delamination forces to prevent wafer damage during processing, with acrylic polymers' glass transition temperatures either being too low for excessive delamination or too high for reduced wettability and cohesive strength issues, and the molecular weight affecting adhesive properties.
Innovation Solution
An adhesive composition for wafer processing films comprising an acrylic polymer with a specific glass transition temperature range (-50°C to 15°C) and weight average molecular weight (50,000 to 1,000,000) combined with a photosensitive gas generating agent, such as diazo compounds, to control delamination forces and enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the glass transition temperature of the acrylic polymer is lowered below -50°C, then the adhesive flexibility is improved, but the delamination force becomes excessively high causing wafer damage
Solution Approach 1:
The patent specifies a glass transition temperature range of -50°C to 15°C for the acrylic polymer, optimizing the balance between flexibility and delamination force. This parameter control prevents excessive delamination force while maintaining adequate adhesive flexibility for the wafer processing application.
2Strength
If the glass transition temperature of the acrylic polymer is raised above 15°C, then the adhesive strength is improved, but the wettability to the wafer decreases and lifting phenomenon occurs
Solution Approach 1:
The patent establishes an upper limit of 15°C for the glass transition temperature of the acrylic polymer to maintain proper wettability and prevent lifting phenomena. This parameter constraint ensures the adhesive remains sufficiently soft to wet the wafer surface effectively while providing adequate bonding strength.
3Ease of operation
If the molecular weight of the acrylic polymer is reduced below 50,000, then the adhesive flow and wettability are improved, but the cohesive strength decreases causing contamination
Solution Approach 1:
The patent specifies a minimum molecular weight of 50,000 for the acrylic polymer to ensure sufficient cohesive strength and prevent adhesive contamination. This molecular weight threshold maintains adequate internal strength while allowing proper adhesive flow and wettability characteristics.
4Strength
If the molecular weight of the acrylic polymer is increased above 1,000,000, then the cohesive strength is improved, but the adhesive properties are deteriorated
Solution Approach 1:
The patent establishes a maximum molecular weight of 1,000,000 for the acrylic polymer to prevent deterioration of adhesive properties. This upper limit ensures the adhesive maintains proper flow characteristics and bonding capability while providing sufficient cohesive strength through the specified molecular weight range.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces delamination force, preventing wafer damage and improving process efficiency by controlling the delamination process through controlled gas generation, maintaining adhesive strength and flexibility.
Implementation Method 1
a photosensitive gas generating agent, such as diazo compounds
Data Source
AI summary
The present invention relates to an adhesive composition for a wafer processing film, a wafer processing film, and a semiconductor wafer processing method. In the semiconductor wafer processing process such as a dicing process or a back grinding process, a delaminating force with respect to a wafer to be attached may be effectively reduced to improve process efficiency and prevent the wafer from being warped or cracked.