Temporary Wafer Adhesive Composition for Easy Release Under Polishing Stress
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Solution Overview
Problem
Existing temporary adhesives for semiconductor wafers struggle to balance a large elastic modulus for withstanding polishing stress while maintaining a small insertion force for easy release, leading to potential warping or deformation during processing.
Innovation Solution
An adhesive composition containing two or more release agent components, specifically polydimethylsiloxane and epoxy group-containing polyorganosiloxane, with a mass ratio of 20:1 to 1:10, and a hydrosilylation reaction-cured adhesive component, including alkenyl group-containing polyorganosiloxane, Si-H group-containing polyorganosiloxane, and a platinum group metal-based catalyst, to form an adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a temporary adhesive with large elastic modulus is used to withstand polishing stress, then the adhesive layer maintains structural integrity during polishing, but the insertion force for releasing the semiconductor wafer becomes too large making removal difficult
Solution Approach 1:
The adhesive layer is segmented into multiple functional components: a base adhesive component providing structural integrity, and multiple release agent components (polydimethylsiloxane with 100,000-2,000,000 molecular weight and epoxy group-containing polyorganosiloxane with 1,000-100,000 molecular weight) that reduce insertion force. This segmentation allows each component to fulfill its specific function without compromising the other.
Solution Approach 2:
The invention uses a composite adhesive composition combining multiple polymer components with specific molecular weight ranges. The base adhesive provides high elastic modulus while the release agent components (specific ratios of polydimethylsiloxane and epoxy group-containing polyorganosiloxane) provide low insertion force characteristics, creating a material that exhibits both strong adhesion during polishing and easy release afterward.
2Ease of operation
If the adhesive layer is made easily releasable with small insertion force, then the semiconductor wafer can be removed easily after polishing, but the adhesive layer cannot withstand polishing stress leading to wafer warping or deformation
Solution Approach 1:
The adhesive system is divided into functional segments: the base adhesive component (components A-1, A-2, and catalyst A-3) provides stress resistance during polishing, while the release agent components (polydimethylsiloxane and epoxy group-containing polyorganosiloxane) provide easy release capability. This functional segmentation resolves the contradiction between strong bonding and easy release.
Solution Approach 2:
The invention controls the molecular weight parameters of the release agent components within specific ranges (polydimethylsiloxane: 100,000-2,000,000; epoxy group-containing polyorganosiloxane: 1,000-100,000) and their mass ratio (B-1:B-2 from 20:1 to 1:10) to optimize the balance between stress resistance and insertion force. These parameter changes enable the adhesive to exhibit different mechanical properties during different process stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves both a large elastic modulus for stress resistance and a small insertion force for easy release, enabling efficient processing of semiconductor substrates without warping or deformation.
Implementation Method 1
a component that is cured by a hydrosilylation reaction, in which the component (A-1) containing an alkenyl group having 2 to 40 carbon atoms bonded to a silicon atom, the component (A-2) containing a Si-H group, and the platinum group metal-based catalyst (A-3)
Data Source
Figure 1~3B
Figure 4~5
Figure 6A~6C
AI summary
An adhesive composition containing two or more release agent components.