Multi-Layer Adhesive System for Wafer Carrier Detachment
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Solution Overview
Problem
The challenge in semiconductor device fabrication lies in maintaining adhesive strength between a carrier and a device wafer during back-grinding and subsequent processes while preventing mechanical deformation and damage, which often results in process failures and reduced yield.
Innovation Solution
A method involving the sequential formation of thermosetting resin glue and release layers between the carrier and device wafer, with the release layers having a lower cross-linking agent content and Young's modulus than the substrates, allowing for controlled detachment and preventing mechanical deformation during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a carrier is attached to a wafer using an adhesive layer during back-grinding, then the wafer can be supported and processed, but the adhesive layer may cause mechanical deformation or prevent easy detachment after processing
Solution Approach 1:
The adhesive system is segmented into multiple functional layers: a first adhesive layer (strong bonding) between the carrier and wafer, and a second adhesive layer (release layer with lower adhesion) between the wafer and support substrate. This segmentation allows strong attachment during processing while enabling easy detachment afterward by targeting the weaker second layer for removal.
Solution Approach 2:
Different regions of the adhesive system have different adhesive properties tailored to their functions. The first adhesive layer has high adhesive strength for secure carrier-wafer bonding, while the second adhesive layer has lower adhesive strength to facilitate release. This local differentiation of adhesive quality resolves the contradiction between strong bonding and easy detachment.
2Strength
If a rigid adhesive layer is used to maintain structural integrity during back-grinding, then the wafer is supported well, but the adhesive layer may crack or cause wafer damage during detachment
Solution Approach 1:
The adhesive layers are designed with different mechanical parameters: the first adhesive layer has high strength and rigidity to maintain structural integrity during back-grinding, while the second adhesive layer has lower strength and higher flexibility to prevent cracking during detachment. By changing these material parameters across layers, both structural support and damage-free detachment are achieved.
Solution Approach 2:
The adhesive system uses composite material structure with two distinct adhesive layers having different mechanical properties. The first layer provides rigidity and strength for structural support, while the second layer provides flexibility and damage resistance for safe detachment. This composite approach allows each layer to optimize for its specific function, resolving the contradiction between structural integrity and mechanical deformation prevention.
3Ease of operation
If multiple adhesive layers are used to achieve both strong bonding and easy release, then detachment is facilitated, but the process complexity increases
Solution Approach 1:
The second adhesive layer acts as an intermediary between the wafer and the support substrate, serving as a controlled release mechanism. This intermediary layer with lower adhesive strength allows for easy detachment by selectively removing or releasing this middle layer, simplifying the overall detachment process despite the multi-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains robust adhesive strength, prevents mechanical deformation, and facilitates easy detachment of the carrier from the wafer, thereby reducing process failures and increasing fabrication yield by enabling uniform plastic deformation and crack propagation in the release layers.
Implementation Method 1
allowing for controlled detachment and preventing mechanical deformation during processing... enabling uniform plastic deformation and crack propagation in the release layers
Implementation Method 2
cracking the first release layer to detach the first substrate from the second substrate... enabling uniform plastic deformation and crack propagation in the release layers
Implementation Method 3
attaching the first substrate to the second substrate in such a way that the first release layer is in contact with the second glue layer... maintains robust adhesive strength
Data Source
AI summary
Provided are methods of fabricating a semiconductor device. According to the method, a first glue layer, a first release layer, a second glue layer, and a second release layer may be sequentially interposed between a carrier and a device wafer. All of the first glue layer, the first release layer, the second glue layer, and the second release layer may be formed of thermosetting resin.