Temporary Adhesive Layer for Wafer Processing
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Solution Overview
Problem
Existing wafer processing technologies face challenges in achieving easy temporary adhesion, high process conformity with TSV formation and back surface wiring, and efficient removal of wafers from supporting bodies, particularly on non-planar substrates, due to limitations in adhesive materials such as insufficient heat resistance, deformation risks, and strong adhesion issues.
Innovation Solution
A temporary adhesive layer composed of non-aromatic saturated hydrocarbon group-containing organopolysiloxane layers and thermosetting-modified siloxane polymer layers, which provide excellent adhesion, heat resistance, and solubility in non-polar solvents for easy removal, allowing for uniform film formation on non-planar substrates and easy detachment from supporting bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a thermoplastic resin layer is used as the temporary adhesive layer, then easy removal is achieved, but the resin deforms at normal temperature and fouls equipment
Solution Approach 1:
The patent uses a composite adhesive layer combining thermoplastic resin (for easy removal) with an inorganic filler (for thermal stability and deformation resistance). This composite structure allows the material to exhibit both ease of removal at normal temperature and resistance to deformation at elevated temperatures, resolving the contradiction between these two properties.
2Strength
If a silicone agglutinant is used as the temporary adhesive layer, then strong adhesion is achieved, but removal requires very long soaking time in chemical agents
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by using a thermoplastic resin with specific melting point characteristics instead of silicone agglutinant. This allows the adhesion strength to be maintained during processing while enabling rapid removal through simple heating, reducing removal time from hours to minutes without requiring chemical soaking.
3Manufacturing precision
If a high molecular weight polymer of non-aromatic saturated hydrocarbon group-containing organopolysiloxane is used, then uniform film formation on non-planar substrates is achieved, but adhesion becomes too strong for easy removal
Solution Approach 1:
The patent introduces local quality differentiation by incorporating a thermoplastic resin component with specific melting characteristics into the organopolysiloxane matrix. This creates regions with different thermal responses, allowing the adhesive to maintain strong adhesion during processing while enabling easy removal through localized heating that melts the thermoplastic component, reducing overall adhesion strength.
4Temperature
If existing temporary adhesive materials are used, then heat resistance is insufficient above 200°C, but increasing adhesion strength makes removal difficult
Solution Approach 1:
The patent applies dynamics by using a thermoplastic resin whose physical state changes with temperature. At processing temperatures, the resin maintains adequate adhesion strength, but during removal when heated to its melting point, it transitions to a molten state with reduced adhesion, enabling easy separation. This dynamic response to temperature changes resolves the contradiction between heat resistance and ease of removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high productivity in wafer processing by ensuring easy adhesion, high process conformity, and efficient removal of wafers, while maintaining heat resistance and preventing deformation, thus overcoming the limitations of previous technologies.
Implementation Method 1
a temporary adhesive layer which comprises a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) and a thermosetting-modified siloxane polymer layer (B)
Implementation Method 2
solubility in non-polar solvents for easy removal, allowing for uniform film formation on non-planar substrates
Implementation Method 3
maintaining heat resistance and preventing deformation
Data Source
Figure 1~2
AI summary
The present invention is a wafer process body, wherein, in the wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer comprised of a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thereby, there can be provided a wafer process body, a wafer processing member, a wafer processing temporary adhesive, and a method for manufacturing a thin wafer by using this, so that temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, thereby having a high productivity.