Semiconductor Wafer Aligner Using Two-Shaft Displacement Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional aligners for correcting semiconductor wafer displacement require a large number of drive shafts, leading to increased complexity, size, and cost due to the use of multiple translation and rotation shafts.
Innovation Solution
An aligner design utilizing a first and second rotation drive mechanism with a shared elevation mechanism, allowing for the correction of planar and rotation displacement using only two drive shafts, reducing the number of parts and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If three drive shafts (two translation shafts and one rotation shaft) are used to correct wafer displacement, then the displacement correction function is achieved, but the device complexity and size increase
Solution Approach 1:
The patent combines two rotation drive mechanisms into a single integrated system where one rotation shaft serves dual purposes: rotating the first support portion and simultaneously rotating the second support portion. This merging eliminates the need for separate drive shafts for each rotation, reducing the total number of parts while maintaining the displacement correction function
Solution Approach 2:
The single rotation shaft performs multiple functions: it rotates the first support portion about the first vertical axis and also rotates the second support portion about the second vertical axis. This multi-functionality allows one component to replace what would traditionally require three separate drive shafts, simplifying the overall device structure
2Manufacturing precision
If two translation shafts and one rotation shaft are used, then wafer position correction is achieved, but the number of parts increases leading to larger device size
Solution Approach 1:
The patent merges multiple drive functions into a compact configuration where one rotation shaft controls both support portions. This consolidation significantly reduces the space required for drive mechanisms, leading to a more compact aligner device with reduced overall volume
Solution Approach 2:
The second support portion is positioned within or adjacent to the first support portion structure, allowing nested arrangement of components. This nesting approach minimizes the horizontal space required while maintaining the functional independence of each support portion
Data Source
AI summary
An aligner includes a first rotation drive mechanism, a second rotation drive mechanism and an elevation mechanism. The first rotation drive mechanism includes a first support portion that supports a workpiece, and a first drive source for rotatively driving the first support portion about a first vertical axis. The second rotation drive mechanism includes a second support portion that supports the workpiece, and a second drive source for rotatively driving the second support portion about a second vertical axis. The elevation mechanism is configured to move the workpiece supported by the second support portion up and down.