Wafer Aligning Device Using E-Actuators and Wedge Actuators
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for aligning and positioning thin semiconductor substrates on carrier substrates lack precision, leading to inefficiencies and potential damage during processing and transport, due to manufacturing tolerances and the need for costly optical adjuvants or complex setups.
Innovation Solution
A device and process utilizing mechanical aligning means, such as E-actuators and wedge actuators, to precisely orient and attach substrates to carrier substrates based on outside contours, without optical aids, ensuring accurate positioning and mechanical stability for further processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If simple mechanical stops are used for positioning, then device complexity is reduced, but positioning precision deteriorates due to manufacturing tolerances
Solution Approach 1:
The patent replaces simple mechanical stops with a sophisticated mechanical positioning system comprising E-actuators, wedge actuators, and alignment means that mechanically enforce precise positioning. The E-actuators adjust the position of the substrate carrier in the x-y plane, while wedge actuators provide z-direction positioning, all through purely mechanical means without optical detection.
Solution Approach 2:
The system changes the positioning parameters by using multiple actuators that can independently adjust position in three dimensions (x, y, z). The E-actuators control lateral position while wedge actuators control vertical position, allowing precise positioning by coordinating multiple parameter adjustments rather than relying on a single mechanical stop.
2Manufacturing precision
If optically detectable passmarks are applied to achieve μm-precision positioning, then positioning precision is improved, but production cost increases
Solution Approach 1:
The patent completely eliminates the need for optical passmarks by replacing optical detection with a mechanical positioning system. The E-actuators and wedge actuators provide direct mechanical positioning and alignment, achieving μm-precision through mechanical means alone, thereby avoiding the cost of optical components and passmark application processes.
Solution Approach 2:
The positioning system is self-aligning through the mechanical design of the E-actuators and wedge actuators, which automatically enforce precise positioning without requiring external optical detection or marking. The system serves its own positioning needs through inherent mechanical constraints and actuator coordination.
3Manufacturing precision
If narrowly tolerated substrate dimensions are produced to improve positioning accuracy, then positioning precision is improved, but production cost increases considerably
Solution Approach 1:
Instead of improving substrate manufacturing precision to achieve positioning accuracy, the patent inverts the approach by maintaining standard substrate tolerances and using a precision mechanical positioning system to achieve the required positioning accuracy. The E-actuators and alignment means compensate for substrate dimensional variations.
Solution Approach 2:
The patent replaces the need for high-precision substrate manufacturing with a mechanical positioning system that actively adjusts and enforces precise positioning. The E-actuators and wedge actuators mechanically compensate for substrate tolerance variations, eliminating the need for costly narrow tolerance substrate production.
4Manufacturing precision
If search routines or readjustment are performed when substrate position is out of field of vision, then positioning completeness is improved, but productivity decreases
Solution Approach 1:
The patent performs preliminary positioning action by using the E-actuators and alignment means to pre-position the substrate exactly within the required field of vision before processing begins. This preliminary mechanical alignment eliminates the need for subsequent search routines or readjustment operations during processing.
Solution Approach 2:
The patent replaces optical search routines with a mechanical positioning system that proactively ensures the substrate is correctly positioned before processing. The E-actuators and alignment means mechanically guarantee positioning completeness, eliminating the need for reactive optical detection and readjustment operations that reduce productivity.
Data Source
AI summary
A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.