Wafer Alignment Calculation for Transfer Robot Approach
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Solution Overview
Problem
Conventional wafer alignment methods are time-consuming due to the repeated rotations and movements required for precise positioning and angulation of wafers by transfer robots.
Innovation Solution
A calculating apparatus that acquires the wafer's center position and angle using image capturing units, calculates the necessary rotational and approach angles, and adjusts the alignment apparatus to allow the transfer robot to approach the wafer in a single direction and distance, eliminating the need for repeated rotations and movements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the alignment apparatus performs multiple rotations and movements to position the wafer at the regular position and angle, then the wafer can be retrieved by the transfer robot at the predetermined position and angle, but the time necessary for alignment becomes long
Solution Approach 1:
The calculating apparatus calculates the rotational angle, approach angle, and distance in advance before the transfer robot approaches the wafer. This preliminary calculation of the optimal approach path allows the transfer robot to directly approach the wafer at the calculated position and angle without requiring multiple rotations and movements by the alignment apparatus, thereby reducing alignment time while maintaining retrieval precision
Solution Approach 2:
The invention replaces the mechanical alignment operations (multiple rotations and movements by the alignment apparatus) with a calculation-based approach. The calculating apparatus computes the necessary rotational angle, approach angle, and distance, allowing the transfer robot to perform a single direct approach operation instead of multiple mechanical alignment steps, thus reducing alignment time while achieving the same positioning precision
2Measurement precision
If the alignment apparatus rotates and moves the wafer multiple times to achieve precise positioning, then the transfer robot can retrieve the wafer accurately, but the complexity of the alignment process increases
Solution Approach 1:
The invention replaces complex mechanical alignment operations with a calculation-based system. The calculating apparatus computes the rotational angle, approach angle, and distance, enabling the transfer robot to perform a single straightforward approach operation. This substitution of mechanical complexity with computational simplicity reduces the alignment process complexity while maintaining retrieval accuracy
Solution Approach 2:
The invention extracts the alignment calculation function from the alignment apparatus and places it in a separate calculating apparatus. This separation allows the alignment apparatus to perform only the necessary rotational operation while the transfer robot handles the approach based on calculated parameters, thereby simplifying the overall alignment process while maintaining retrieval accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time required for wafer alignment by streamlining the process and improving precision, while also reducing the size of the apparatus and enhancing accuracy.
Implementation Method 1
the acquiring portion includes an image capturing unit that captures an image of the wafer placed on the alignment apparatus
Data Source
AI summary
A calculating apparatus includes an acquiring portion and a calculating portion. The acquiring portion acquires a center position of a wafer placed on an alignment apparatus, and a wafer angle corresponding to a marker such as an orientation flat. The calculating portion calculates by using the wafer center position and the wafer angle, a rotational angle of the wafer on the alignment apparatus, an approach angle, which is an angle of a direction in which a transfer robot approaches the wafer, and a distance between the wafer after the rotation and the transfer robot. Then, the alignment apparatus rotates the wafer by the rotational angle. The transfer robot turns by the approach angle. Subsequently, the transfer robot extends its arm according to the distance, thereby approaching the wafer, and retrieves the wafer.