Modular Wafer Alignment for Compact Metrology Handling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Space-constrained semiconductor manufacturing environments require smaller automated apparatuses for handling, positioning, and aligning wafers, as typical industrial robots like SCARA robots are unsuitable due to their size and incompatibility with processing equipment.

Innovation Solution

An apparatus comprising an end effector module, pluck module, alignment module, chuck module, and stage module, controlled by a controller module, to precisely rotate and align wafers to a predetermined orientation for inspection or processing, utilizing vacuum grooves, motors, and optical sensors for precise alignment and movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If typical industrial robots (e.g., SCARA robots) are used for wafer handling, then automation capability is provided, but the size and footprint are too large for space-constrained semiconductor manufacturing areas

Engineering Contradiction:

Improveautomation capabilityVSAvoidfootprint size

Core Design Contradiction:

Extent of automationVSArea of stationary object

Solution Approach 1:

The apparatus is divided into multiple functional modules including an end effector module for wafer retrieval, a pluck module for rotation, a chuck module for holding, and a stage module for positioning. Each module performs a specific function, allowing the system to achieve full automation capability while maintaining a compact overall footprint by eliminating the need for large industrial robot arms.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple functions (wafer retrieval, rotation, positioning, and holding) are combined into a single integrated apparatus. The end effector module, pluck module, chuck module, and stage module work together in one compact unit, replacing what would traditionally require separate large industrial robots and positioning systems.

Inventive Principle:

Principle #5Merging (Combining)

2Extent of automation

If typical industrial robots are used for wafer handling, then automated positioning is achieved, but compatibility with processing equipment is lost

Engineering Contradiction:

Improveautomated positioningVSAvoidcompatibility with processing equipment

Core Design Contradiction:

Extent of automationVSAdaptability or versatility

Solution Approach 1:

The apparatus features a specialized end effector with vacuum grooves designed specifically for wafer handling, and a chuck module with vacuum chambers tailored to wafer dimensions. These localized adaptations ensure compatibility with semiconductor processing equipment while maintaining automated positioning capabilities, unlike generic industrial robots.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The apparatus is designed to handle multiple wafer sizes and orientations through its modular configuration. The pluck module can rotate wafers to predetermined orientations, and the stage module can position wafers at various locations, making the system adaptable to different processing stations including metrology, inspection, and fabrication equipment.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If wafer rotation is performed during metrology, then precise alignment for multiple orientations is achieved, but measurement time increases

Engineering Contradiction:

Improvealignment precisionVSAvoidmeasurement time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The pluck module rotates the wafer to a predetermined orientation before the wafer is measured by the metrology system. This preliminary alignment ensures that the wafer is in the correct orientation for measurement, eliminating the need for time-consuming real-time adjustments during the measurement process itself.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system replaces manual or mechanical real-time adjustment during measurement with automated pre-positioning. The controller module coordinates the pluck module's rotation and the stage module's positioning to deliver the wafer pre-aligned to the metrology station, reducing measurement time while maintaining precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise wafer rotation and alignment in space-constrained areas, facilitating efficient handling and inspection processes such as metrology, particularly for Silicon Photonics and Co-Packaged Optics chips with multiple orientations.

Implementation Method 1

an end effector configured to releasably hold the wafer using a pattern of vacuum grooves operatively coupled to a vacuum source

Methodology Applied

Scientific EffectVacuum: Vacuum

Implementation Method 2

an alignment module configured to use the alignment feature to determine a virtual center of the wafer during rotation of the wafer by the pluck module

Methodology Applied

Scientific EffectOptical detection: Photoelectric Effect

Data Source

PatentUS20260047389A1Apparatus for wafer handling and alignment

Publication Date: 2026.02.12 N&K TECHNOLOGY INC

AI summary

Described is an apparatus for wafer handling and alignment. The apparatus can be used for at least handling and aligning wafers for subsequent processing by inspection stations or metrology instruments. The apparatus can include at least an end effector module, a pluck module, an alignment module, a chuck module, and a controller module.