Wafer Alignment Using Diffraction Marks for Precise Bonding
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Solution Overview
Problem
Existing technologies face challenges in precisely bonding semiconductor wafers to achieve improved performance and smaller size in semiconductor devices, necessitating enhanced precision in the wafer bonding process.
Innovation Solution
A substrate alignment apparatus utilizing diffraction-based recognition modules to accurately align substrates through diffracted light interference patterns, enabling precise recognition of alignment marks and reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used for wafer bonding, then the bonding process can be completed, but the alignment precision is insufficient to achieve better device performance and smaller size
Solution Approach 1:
The patent replaces conventional mechanical or optical alignment systems with a diffraction-based alignment system. Alignment marks with periodic structures are used to generate diffraction patterns, which are then analyzed to determine precise alignment positions. This substitution of mechanical/optical methods with diffraction-based methods enables higher alignment precision while maintaining bonding reliability
Solution Approach 2:
The patent changes the physical parameters of the alignment marks by using periodic structures that exploit diffraction phenomena. By designing alignment marks with specific periodic patterns and using light sources that generate diffraction patterns, the system achieves enhanced alignment precision through optical parameter changes rather than relying on conventional geometric alignment methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances the precision and reliability of substrate alignment and bonding processes, improving the manufacturing of semiconductor devices with better performance and reduced size.
Implementation Method 1
configured to recognize the second alignment mark using diffracted light reflected from the second alignment mark
Implementation Method 2
diffracted light reflected from the second alignment mark
Implementation Method 3
recognize the second diffraction grating using a first pattern generated via interference of light reflected from the second diffraction grating
Data Source
AI summary
A substrate alignment apparatus is provided which includes a first support including first and second side surfaces opposite each other, wherein a first substrate on which a first alignment mark has been formed is placed on the first support; a second support disposed on the first support and including third and fourth side surfaces opposite each other, wherein a second substrate on which a second alignment mark has been formed is placed on the second support; a first recognition module disposed on the first side surface and configured to recognize the second alignment mark using diffracted light reflected from the second alignment mark; and a second recognition module disposed on the fourth side surface positioned above the second side surface and configured to recognize the first alignment mark using diffracted light reflected from the first alignment mark.