Wafer Alignment Device with Integrated ID Reading and Dual Mounting Tables
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Solution Overview
Problem
Current alignment devices for semiconductor wafers face challenges such as reduced throughput due to the need for fine adjustments of robot arms, increased size and cost due to separate ID reading units for each wafer, and complications in holding and replacing suction pads, especially when aligning and reading multiple wafers simultaneously.
Innovation Solution
An alignment device with multiple mounting tables arranged side by side, equipped with movement units for rotating and moving wafers, notch detection units for precise alignment, and a controller to manage wafer positions and prevent interference, along with a pad design that facilitates easy attachment and detachment and reduces particle adhesion, and an integrated ID reading unit for simultaneous wafer alignment and ID reading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two alignment devices are mounted side by side in a sorter, then the alignment capacity is increased, but the footprint of the sorter is increased which reduces throughput
Solution Approach 1:
The patent combines two alignment devices into a single integrated device with dual mounting tables (first and second mounting tables) that can simultaneously hold and align multiple wafers. This merging approach maintains the alignment capacity of two separate devices while reducing the overall footprint and improving sorter throughput.
Solution Approach 2:
The alignment device is designed with multi-functionality to perform alignment of multiple wafers simultaneously using a single device. The device includes multiple mounting tables, notch detection units, and ID reading units that can operate concurrently on different wafers, making the single device equivalent to multiple separate alignment devices.
2Productivity
If one alignment device is designed to align two wafers simultaneously, then the footprint is reduced, but the device becomes complicated and costs increase
Solution Approach 1:
The alignment device is segmented into independent functional modules including first and second mounting tables, corresponding notch detection units, and ID reading units. Each module can operate independently on its assigned wafer, which simplifies the overall control logic and reduces device complexity while maintaining the capability to align two wafers simultaneously.
Solution Approach 2:
The device uses identical or similar components for each wafer alignment station (mounting tables, notch detection units, ID reading units). This copying approach standardizes the design, reduces complexity through component reuse, and lowers costs by using the same proven technology multiple times rather than designing unique systems for each function.
3Loss of time
If two wafers are aligned side by side in horizontal direction, then alignment time is reduced, but holding postures need changing which lowers throughput
Solution Approach 1:
The mounting tables are designed to be rotatable, allowing dynamic adjustment of wafer orientations. The tables can rotate to different angular positions to accommodate various holding postures required for different processing steps. This dynamic capability enables the system to maintain optimal throughput by adjusting orientations without requiring manual intervention or repositioning between alignment and processing steps.
4Measurement precision
If separate ID reading units are provided for each wafer, then ID reading accuracy is improved, but the device size and cost increase
Solution Approach 1:
The ID reading units are positioned to read IDs from multiple wafers simultaneously or in rapid succession. By merging the reading function across multiple wafers and using a single reading position, the device maintains accurate ID reading capability while reducing the overall device footprint compared to providing separate dedicated reading units for each wafer.
Data Source
AI summary
An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.