Semiconductor Wafer Alignment Apparatus with Laser Notch Detection
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Solution Overview
Problem
In semiconductor manufacturing, precise and stable alignment of semiconductor wafers is challenging due to the increasing fineness of surface structures, which can lead to damage during alignment processes.
Innovation Solution
An alignment apparatus with a support member, driving unit, pushing members, notch detecting units, height detecting units, and a controller to position and stabilize semiconductor wafers by rotating the support member and applying forces to ensure accurate alignment of notches and edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional alignment methods are used, then the alignment process is simple, but the alignment precision deteriorates due to damage risk during handling
Solution Approach 1:
The apparatus performs preliminary detection of the wafer's notch position using a laser sensor before alignment. The detector identifies the notch location in advance, allowing the system to plan and execute alignment movements that avoid damaging the wafer, thus resolving the contradiction between alignment precision and damage risk
Solution Approach 2:
The system uses a laser sensor to continuously detect the wafer's position and notch orientation during the alignment process. This feedback mechanism allows real-time adjustment of alignment movements, ensuring precise positioning while preventing damage by avoiding excessive or incorrect movements
2Stability of the object's composition
If manual alignment operations are performed, then the device complexity is low, but the alignment stability deteriorates
Solution Approach 1:
The alignment apparatus performs self-alignment by automatically detecting the wafer's notch position using a laser sensor and autonomously rotating the wafer to the correct orientation. This eliminates the need for manual intervention, providing stable and repeatable alignment results while accepting increased device complexity through automation
Solution Approach 2:
The system replaces manual mechanical alignment operations with an automated control system that uses laser detection and motorized rotation. This substitution of mechanical manual operations with automated sensing and actuation systems provides greater stability and precision, justifying the increased device complexity
3Manufacturing precision
If the support member rotates freely, then the ease of operation is high, but the alignment precision deteriorates due to positioning instability
Solution Approach 1:
The laser sensor provides continuous feedback on the wafer's rotational position and notch orientation. This feedback allows the control system to precisely control the rotation and stopping position of the support member, achieving high positioning precision while maintaining ease of operation through automated control
Solution Approach 2:
The system performs preliminary detection of the notch position before completing the rotation. This allows the control system to calculate and execute the precise rotation angle needed to bring the notch to the target position, ensuring manufacturing precision while keeping the operation simple through automated calculation and execution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables precise and stable alignment of semiconductor wafers by detecting notch and edge positions using laser sensors and adjusting the support member to prevent damage, ensuring accurate placement and stability during the manufacturing process.
Implementation Method 1
The height detecting unit may include a laser sensor, the laser sensor may include a light emitting unit configured to emit a laser beam, and a light receiving unit configured to receive the laser beam emitted from the light emitting unit
Data Source
AI summary
Disclosed is an alignment apparatus that aligns a treatment object having a notch. The alignment apparatus includes a support member on which the treatment object is positioned, a driving unit configured to rotate the support member, a pushing member configured to move the treatment object to a proper location on the support member by applying a force to a side surface of the treatment object positioned on the support member, a notch detecting unit configured to detect whether the notch of the treatment object is located at a specific location, and a controller configured to control the driving unit such that the notch of the treatment object is located at the specific location by rotating the support member.