System-on-Wafer Alignment Structure for Bonding Pad Registration
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Solution Overview
Problem
The traditional stacked assembly method for Software Defined System on Wafer (SOW) faces issues such as poor contact, dislocation of bonding pads, and interlayer creep, leading to low yield and a lack of effective assembly and inspection techniques.
Innovation Solution
A system on wafer assembly structure comprising a wafer layer, dielectric layer, and circuit board layer with specific bonding, testing, and alignment regions, along with a first and second assembly that allow for detachable connections and alignment adjustments through latch and hole portions, enabling precise alignment and electrical conduction testing to ensure accurate assembly and prevent poor contact and dislocation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional stacked assembly method is used, then assembly process is simple, but contact quality is poor and bonding pads dislocate
Solution Approach 1:
The patent introduces a positioning assembly as an intermediary component between the wafer layer and circuit board layer. This positioning assembly includes positioning protrusions and positioning grooves that mediate the alignment process, ensuring accurate bonding pad alignment while maintaining a manageable assembly structure. The intermediary positioning mechanism resolves the contradiction by providing a dedicated alignment interface that prevents direct misalignment between layers.
Solution Approach 2:
The assembly structure is segmented into distinct functional components: wafer layer, positioning assembly with bearing portion and latch portion, dielectric layer, and circuit board layer. The positioning assembly itself is segmented into bearing portion (for holding wafer), latch portion (for alignment), and connection portion (for bonding). This segmentation allows each component to perform its specific function optimally, improving contact quality without overwhelming complexity.
2Manufacturing precision
If traditional stacked assembly method is used, then assembly process is simple, but bonding pads dislocate and interlayer creep occurs
Solution Approach 1:
The positioning assembly performs preliminary alignment actions before final bonding. The bearing portion pre-positions the wafer layer, and the latch portion with its hole portion configuration enables preliminary alignment of bonding pads. This preliminary positioning action ensures that when layers are stacked, the alignment is already established, preventing dislocation and creep during subsequent bonding processes.
Solution Approach 2:
The positioning assembly acts as a mediator that transfers and maintains precise alignment information between the wafer layer and circuit board layer. The positioning protrusions and grooves serve as intermediary alignment features that guide the relative positioning, ensuring manufacturing precision while keeping the overall assembly structure manageable through standardized positioning interfaces.
3Adaptability or versatility
If detachable connection with latch portion is used, then alignment can be adjusted, but assembly structure becomes complex
Solution Approach 1:
The connection between the positioning assembly and other layers transitions from a static fixed connection to a dynamic adjustable connection. The latch portion can be detached and reattached, allowing alignment adjustments during assembly. The bearing portion holds the wafer while allowing positional adjustments. This dynamic capability provides adaptability for alignment correction without requiring an overly complex assembly structure, as the adjustability is built into the connection mechanism itself.
Data Source
AI summary
A system on wafer assembly structure and an assembly method thereof. The system on wafer assembly structure comprises: a wafer layer, a dielectric layer and a circuit board layer sequentially stacked, and each provided with a bonding region, a testing region and an alignment region, respectively, a first assembly, and a second assembly, wherein the first assembly is arranged on one side of the wafer layer far away from the dielectric layer, and comprises a bearing portion and at least one latch portion connected with each other, and the bearing portion is detachably connected with the wafer layer. The second assembly is at least partially arranged around the first assembly. The second assembly has a hole portion for accommodating a latch portion, and the inner diameter of the hole portion is larger than the outer diameter of the latch portion.