Wafer Angle Trajectory Analysis for Defect Source Localization

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Solution Overview

Problem

The existing method for analyzing wafer angles in semiconductor integrated circuit manufacturing is labor-intensive and prone to errors, requiring manual investigation of multiple angle data points, which increases the risk of production line accidents.

Innovation Solution

A method and system that automatically collect machine angle data, predict angle trajectory maps, perform grouping of defective wafers based on defect types and directions, and calculate direction differences to determine the site and machine where defects occur, thereby reducing manual analysis and increasing efficiency and accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If manual analysis method is used to investigate machine angle data, then analysis can be performed with simple equipment, but the workload is large and time consumption is high

Engineering Contradiction:

Improvesimplicity of equipmentVSAvoidtime consumption

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The patent replaces the manual mechanical investigation process with an automated computer-based system. The system automatically collects machine angle data, performs grouping operations, and identifies defect sources without requiring manual investigation of multiple angle data points, thereby significantly reducing time consumption while maintaining analytical capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of operation

If manual investigation of angle data is performed step by step, then the analysis process is simple to implement, but the risk index of production line increases

Engineering Contradiction:

Improvesimplicity of processVSAvoidproduction line safety

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent replaces manual investigation processes with automated computer-based analysis. The system rapidly collects and analyzes machine angle data, identifying defect sources before the risk index can increase to dangerous levels. This automation maintains operational simplicity while significantly improving production line safety by reducing the time window for potential accidents.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system implements continuous monitoring and analysis of machine angle data with automatic feedback mechanisms. By rapidly processing angle data and identifying defect sources in real-time, the system provides feedback that allows for immediate corrective action, preventing the risk index from escalating and improving overall production line reliability.

Inventive Principle:

Principle #23Feedback

3Measurement precision

If all machine angle data is manually checked to identify defect sources, then measurement completeness is high, but productivity is low

Engineering Contradiction:

Improvecompleteness of data checkVSAvoidanalysis efficiency

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent applies segmentation by dividing the large set of machine angle data into meaningful groups based on defect types and directions. The system performs first grouping according to defect types and second grouping according to defect directions, allowing efficient identification of defect sources without requiring manual checking of all individual angle data points, thereby maintaining measurement completeness while significantly improving productivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces manual data checking with automated computer-based analysis that can rapidly process and analyze all machine angle data. The automated system performs complete data checking and grouping operations much faster than manual methods, achieving both high measurement completeness and high productivity simultaneously.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250069955A1Method and System for Analyzing Wafer Angle in Semiconductor Integrated Circuit Manufacturing

Publication Date: 2025.02.27 SHANGHAI HUALI MICROELECTRONICS CORP

AI summary

This application discloses a method for analyzing a wafer angle in semiconductor integrated circuit manufacturing, including step 1: collecting machine angle data; step 2: predicting and forming an angle trajectory map of each analyzed wafer in a process according to the machine angle data; step 3: performing first grouping on defective wafers in an analyzed lot according to defect types; step 4: selecting one first group as a selected group, and performing second grouping on each defective wafer in the selected group according to defect directions; and step 5: calculating a direction difference between defect directions of second groups, and determining a site and a machine where a defect occurs in combination with the direction difference and an angle difference in the angle trajectory map of each detective wafer in the selected group. This application further discloses a system for analyzing a wafer angle in semiconductor integrated circuit manufacturing.