Automated Array Area Identification in Wafer Inspection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current wafer inspection systems require manual setup of array care areas, which is time-consuming and prone to errors, leading to reduced sensitivity and increased inspection time due to limitations in automated array area identification and page break detection.
Innovation Solution
A computer-implemented method that compares array patterns in template images to search area images using pattern matching and texture analysis to automatically identify array areas and page breaks, reducing setup time and improving sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual method is used to define array care areas, then the accuracy of array area identification can be improved, but the setup time increases significantly
Solution Approach 1:
The system performs self-service by automatically identifying array care areas through image processing and pattern recognition algorithms. The inspection system acquires images of the wafer, processes them to detect array patterns, and automatically defines care areas without requiring manual user input, thereby resolving the contradiction between accuracy and setup time.
2Loss of time
If automated method is used to identify array areas, then the setup time is reduced, but the accuracy and reliability of identification deteriorates
Solution Approach 1:
The patent replaces the manual mechanical process of defining care areas with an automated image processing system. The system uses optical imaging combined with algorithmic pattern recognition to automatically identify array areas, substituting human manual operations with automated computational methods that maintain both speed and accuracy.
Solution Approach 2:
The patent introduces image processing algorithms and pattern recognition techniques as intermediaries between the raw wafer images and the final care area definitions. These intermediary processing steps enable automated systems to achieve accurate identification by transforming and analyzing image data through multiple computational stages.
3Ease of operation
If manual care area setup is performed, then the complexity of the process increases due to thousands of care areas, but the ease of operation is maintained through user interface helpers
Solution Approach 1:
The system eliminates the need for users to manually configure thousands of care areas by implementing self-service automation. The inspection system automatically acquires images, processes them through pattern recognition algorithms, and generates care area definitions without requiring user interaction, thereby reducing operational complexity while maintaining ease of use.
4Reliability
If array care areas are not properly defined, then the inspection sensitivity is reduced, but the setup time is saved by skipping the setup process
Solution Approach 1:
The patent implements preliminary action by automatically performing care area identification as a prerequisite step before inspection. The system acquires images and processes them to define care areas in advance, ensuring that accurate care area definitions are established before the actual inspection process begins, thereby maintaining high sensitivity without requiring manual setup time.
Data Source
AI summary
Methods for identifying array areas in dies formed on a wafer and methods for setting up such methods are provided. One method for identifying array areas in dies formed on a wafer includes comparing an array pattern in a template image acquired in one of the array areas to a search area image acquired for the wafer. The method also includes determining areas in the search area image in which a pattern is formed that substantially matches the array pattern in the template image based on results of the comparing step. In addition, the method includes identifying the array areas in the dies formed on the wafer based on results of the determining step.