Wafer Assembly With Interlocking Wafers And Conductive Spring
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Solution Overview
Problem
High density electrical connectors face interference issues due to their compact design, which negatively impact electrical performance, especially in connectors with multiple rows of contacts, and there is a need for a solution that enhances electrical performance while maintaining a compact design.
Innovation Solution
A wafer assembly for electrical connectors is designed with a first and second wafer, each having contacts and an overmold, with a conductive spring member sandwiched between them, and electronic components like voltage suppressors or resistors integrated between the wafers to provide different electrical properties, such as protection against electromagnetic interference or electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a compact high density connector design is used, then the connector density is improved, but electrical interference increases
Solution Approach 1:
Electronic components (voltage suppressors, resistors, capacitors) are introduced as intermediary elements between contacts to suppress electrical interference. These components act as mediators that filter electromagnetic signals and prevent interference propagation while maintaining the compact high-density connector structure.
Solution Approach 2:
Electronic components are nested within the connector assembly by positioning them between contact rows and securing them in recesses of the housing. This nesting approach allows interference suppression components to be integrated into the compact connector design without increasing overall dimensions.
2Reliability
If electronic components are added to suppress interference, then electrical performance is improved, but device complexity increases
Solution Approach 1:
Multiple electronic components (voltage suppressors, resistors, capacitors) are combined into a single connector assembly, with each component mounted in designated recesses. This merging approach consolidates interference suppression functionality within the existing connector structure rather than adding separate external components.
Solution Approach 2:
The connector housing is designed with multi-functional recesses that serve both structural support and component mounting functions. The same housing structure provides mechanical support for contacts while also accommodating electronic components, thereby reducing overall device complexity.
3Quantity of substance
If multiple rows of contacts are used to increase density, then connector capacity is improved, but interference between contacts increases
Solution Approach 1:
Electronic components are positioned between adjacent contact rows to act as intermediaries that block electromagnetic interference. Voltage suppressors and resistors placed in the spaces between contact rows prevent crosstalk and interference propagation while allowing the multiple rows necessary for high capacity.
Solution Approach 2:
Electronic components are selectively positioned at specific locations between contact rows where interference is most likely to occur. This local placement strategy targets interference suppression at critical points rather than requiring uniform coverage throughout the entire connector assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wafer assembly effectively enhances electrical performance by reducing interference and improving signal integrity through the integration of electronic components, while maintaining a compact design suitable for high density connectors.
Implementation Method 1
A conductive spring member is sandwiched between the first and second wafers
Implementation Method 2
Each of the electronic components is in electrical contact with the spring member and at least one of the contacts of the first or second wafer to provide at least one different electrical property to the wafer assembly
Implementation Method 3
the at least one electronic component is a voltage suppressor, a grounding chip, and/or a resistor
Data Source
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AI summary
A wafer assembly for an electrical connector, and method for making, that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board where the mating and tail ends extend from opposite sides of the wafer. A conductive spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more electronic components in electrical contact with the spring member and one of the contacts.