Wafer Assembly With Interlocking Wafers and Filter Components
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Solution Overview
Problem
High density electrical connectors, such as those used in the aeronautics industry, face challenges in suppressing electromagnetic and radio frequency interference due to their compact design, particularly for connectors with multiple rows of contacts.
Innovation Solution
A wafer assembly for electrical connectors is designed, comprising two wafers with conductive elongated spring members and filter components, such as capacitor chips, sandwiched between them, to interlock and provide a compact mechanism for suppressing interference. The wafers have overmolds with block sections and alignment elements for proper alignment and retention, with side spring arms in contact with filter components for electrical connection and grounding paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a high density electrical connector with multiple rows of contacts is used, then the connector achieves compact design and high contact density, but electromagnetic and radio frequency interference increases
Solution Approach 1:
Filter components are nested within the connector assembly by being received in recesses of the overmold, with the first and second wafers sandwiching the filters and spring member. This nesting approach allows filtering functionality to be integrated into the compact connector structure without significantly increasing its external dimensions, thus maintaining high contact density while suppressing electromagnetic interference.
Solution Approach 2:
Filter components act as intermediary elements positioned between the contact rows to block electromagnetic interference. The conductive spring member serves as another intermediary, providing both mechanical compression to ensure electrical contact with the filters and an additional shielding path. These intermediary elements effectively隔断 the interference while fitting within the compact connector architecture.
2Object-affected harmful factors
If filter components are added to suppress interference, then electromagnetic and radio frequency interference is reduced, but the connector design becomes more complex
Solution Approach 1:
Multiple functions are merged into a unified structure: the overmold provides both structural support and houses recesses for filter components; the spring member simultaneously provides mechanical compression, electrical contact with filters, and additional shielding; the wafer assembly integrates contacts, overmold, filters, and spring member into a single interlocking unit. This merging reduces the number of separate components and simplifies assembly despite adding filtering functionality.
Solution Approach 2:
The spring member exhibits multi-functionality by serving as both a mechanical element (providing compression force to ensure electrical contact) and an electrical element (providing shielding and conductive path). The overmold also serves dual purposes as both structural support and filter housing. This multi-functionality reduces the need for additional dedicated components, thereby limiting the increase in device complexity.
3Object-affected harmful factors
If filter components are integrated into the connector, then interference suppression is achieved, but manufacturing difficulty increases
Solution Approach 1:
Filter components are pre-positioned in recesses of the overmold before final assembly, and the spring member is pre-compressed to store mechanical energy. This preliminary action ensures proper positioning and contact pressure during assembly, reducing the skill level and time required for manufacturing while ensuring consistent electrical contact and filtering performance.
Solution Approach 2:
The connector is divided into modular wafer assemblies that can be manufactured and tested separately before final integration. Each wafer assembly contains a complete set of contacts, overmold, filters, and spring member, allowing for standardized manufacturing processes and simplified quality control. This segmentation reduces overall manufacturing complexity despite the added filtering components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses electromagnetic and radio frequency interference, enhancing the electrical performance of high density connectors while maintaining a compact design, by ensuring proper alignment and electrical contact between the wafers and filter components.
Implementation Method 1
an elongated spring member sandwiched between the first and second wafers, the elongated spring member being conductive
Implementation Method 2
designed to filter and suppress electromagnetic and radio frequency interference
Implementation Method 3
the at least one filter component is in electrical contact with the elongated spring member and at least one of the contacts of the first or second wafer for suppressing electrical interference. In a preferred embodiment, the filter component is a capacitor chip
Data Source
AI summary
A wafer assembly for an electrical connector that has a first and second wafers configured to interlock with one another. Each of the wafers has at least one contact that has a body portion with a mating end for coupling to a mating contact and a tail end opposite the mating end for engaging a printed circuit board and an overmold covering the body portion such that the mating and tail ends extend from opposite sides of the overmold. A conductive elongated spring member is sandwiched between the first and second wafers. The wafer assembly can include one or more filter components.