Wafer Backgrinding and Edge Trimming Integration
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Solution Overview
Problem
Conventional wafer fabrication processes require separate machines for surface grinding and edge trimming, leading to increased capital equipment costs, space requirements, and manufacturing complexity due to the need for additional process steps.
Innovation Solution
A single machine apparatus capable of transitioning between surface grinding and edge trimming operational states, utilizing a rotary turntable and adjustable sensors to condition both the top surface and perimeter edges of workpieces, allowing for simultaneous surface grinding and edge trimming on a single machine.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate machines are used for surface grinding and edge trimming, then each machine can be optimized for its specific function, but capital equipment costs increase and space requirements increase
Solution Approach 1:
The patent combines surface grinding and edge trimming functions into a single machine platform. The system integrates a surface grinding spindle, an edge trimming spindle, a rotary turntable for workpiece positioning, and a control system that coordinates both operations, thereby reducing the number of separate machines while maintaining functional optimization
Solution Approach 2:
The machine is designed with universal capabilities to perform multiple functions: surface grinding of the wafer top surface, edge trimming of the wafer perimeter, and positioning operations. The control system enables the same mechanical platform to execute different processing modes based on operational requirements
2Manufacturing precision
If separate machines are used for surface grinding and edge trimming, then each machine can be optimized for its specific function, but space requirements increase
Solution Approach 1:
By merging surface grinding and edge trimming into one physical machine, the patent significantly reduces the floor space required compared to housing two separate machines. The integrated design shares common components such as the rotary turntable, control system, and structural framework
Solution Approach 2:
The machine serves multiple functions within a single footprint, including surface grinding, edge trimming, and workpiece positioning. This multi-functionality eliminates the need for dedicated space for separate grinding and trimming machines
3Manufacturing precision
If separate machines are used for surface grinding and edge trimming, then each machine can be optimized for its specific function, but manufacturing complexity increases due to additional process steps
Solution Approach 1:
The patent merges surface grinding and edge trimming into a single integrated process flow. The control system coordinates the sequence of operations automatically, allowing the machine to perform surface grinding followed by edge trimming without requiring manual intervention or transfer between machines
Solution Approach 2:
The integrated system enables continuous processing where surface grinding and edge trimming are performed in sequence without interruption. The rotary turntable and coordinated spindles maintain continuous operation, eliminating idle time associated with transferring workpieces between separate machines
4Device complexity
If a single machine performs both surface grinding and edge trimming, then capital equipment costs decrease and space requirements decrease, but the machine must be able to transition between operational states
Solution Approach 1:
The machine incorporates dynamic positioning capabilities where the rotary turntable can be rotated to different angular positions to present the workpiece to either the surface grinding spindle or the edge trimming spindle. The system dynamically transitions between grinding and trimming modes through coordinated motion control
Solution Approach 2:
The machine is designed with universal adaptability to perform multiple operations. The control system manages transitions between surface grinding and edge trimming by activating the appropriate spindle and positioning the workpiece accordingly, demonstrating flexible multi-functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces capital equipment costs, minimizes space requirements, and simplifies manufacturing by integrating surface grinding and edge trimming into a single process, enhancing efficiency and reducing wafer defects through precise edge trimming.
Implementation Method 1
a grind spindle configured to overlay the turntable and functionally engage the workpiece when rotated thereunder, wherein the apparatus is configured to transition between a first operational state and a second operational state
Data Source
AI summary
A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.