Wafer Backside Cleaning with Twin-Fluid Nozzles and Dual Chucks

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Solution Overview

Problem

Existing wafer cleaning methods, particularly for the back surface, suffer from inefficiencies such as frequent equipment replacement, scratches, and reverse contamination due to contact cleaning methods, and fail to effectively remove particles that cause defocusing during exposure processes.

Innovation Solution

A non-contact twin-fluid nozzle method is employed to clean the center and edge areas of the wafer, using a dualized cleaning process with a center chuck, side chuck, and nozzles to spray cleaning solution while minimizing contamination and equipment replacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact cleaning methods are used to clean the back surface of the wafer, then cleaning power is sufficient to remove particles, but equipment replacement frequency increases and scratches occur on the wafer surface

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoidequipment replacement frequency

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces contact-based mechanical cleaning methods with a non-contact cleaning system that uses a nozzle to喷射 cleaning solution. This substitution eliminates the mechanical contact between cleaning equipment and the wafer surface, preventing scratches while maintaining effective particle removal through fluid dynamics and chemical action.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention employs a nozzle-based system that utilizes pneumatic or hydraulic principles to deliver cleaning solution to the wafer surface. The cleaning solution is喷射 at controlled pressure and flow rates, enabling effective particle removal without mechanical contact, thereby reducing equipment wear and replacement frequency.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If cleaning solution is sprayed during the cleaning process of one surface of the wafer, then cleaning effectiveness is improved, but reverse contamination of the wafer occurs

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidreverse contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the cleaning process into distinct zones using a housing structure with a guide part. The housing segments the cleaning solution flow path, confining it to the intended cleaning area. This segmentation prevents the cleaning solution from spreading to other surfaces of the wafer, eliminating reverse contamination while preserving cleaning effectiveness in the target zone.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The housing structure acts as an intermediary element between the nozzle and the wafer. It controls and directs the cleaning solution flow, serving as a barrier that prevents the solution from reaching unintended areas of the wafer, thus preventing reverse contamination while allowing effective cleaning of the targeted surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If dualized cleaning process is used for center and edge of one surface of the wafer, then mutual contamination during cleaning is reduced, but device complexity increases

Engineering Contradiction:

Improvemutual contaminationVSAvoidcleaning process structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent implements a dualized cleaning process by dividing the cleaning function into separate nozzles or nozzle zones for the center and edge areas of the wafer. This segmentation allows independent control of cleaning solution flow to different regions, preventing mutual contamination between zones while using a relatively simple housing structure to manage the divided cleaning paths.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances cleaning efficiency, reduces equipment costs, prevents scratches, and minimizes reverse contamination, thereby improving the quality of the exposure process by effectively removing particles that cause defocusing.

Implementation Method 1

a center chuck configured to adhere a center of one surface of a wafer and rotate around a center axis of the center chuck, that extends in a first direction, to rotate the wafer

Methodology Applied

Scientific EffectVacuum adhesion: Vacuum

Implementation Method 2

at least one nozzle part configured to spray a cleaning solution toward the one surface of the wafer

Methodology Applied

Scientific EffectFluid spray: Fluid Spray

Implementation Method 3

a side chuck including at least one grip part configured to support an edge of the one surface of the wafer; a housing including a guide part configured to guide the side chuck to move horizontally

Methodology Applied

Scientific EffectMechanical support and movement:

Data Source

PatentUS20260018431A1Wafer cleaning apparatus

Publication Date: 2026.01.15 SAMSUNG ELECTRONICS CO LTD

AI summary

A wafer cleaning apparatus may include: a center chuck configured to adhere a center of one surface of a wafer and rotate around a center axis of the center chuck, that extends in a first direction, to rotate the wafer; a side chuck including at least one grip part configured to support an edge of the one surface of the wafer; a housing including a guide part configured to guide the side chuck to move horizontally in a second direction perpendicular to the first direction; and at least one nozzle part configured to spray a cleaning solution toward the one surface of the wafer.