Wafer-Based OLEDoS Display Panel with Segmented CMOS Driving
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current wearable devices, such as head-mounted displays (HMD) and augmented reality (AR) glasses, face challenges in achieving high production yields and ease of repair for display panels with high-resolution light emitting elements on semiconductor wafer substrates.
Innovation Solution
The proposed solution involves a display device with a display panel that includes a semiconductor wafer substrate, a CMOS layer with independently driven display driving circuits, a transistor layer with oxide-based thin film transistors, a light emitting element layer, and an encapsulation layer. This configuration allows for increased production yield and simplified repair of the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-resolution light emitting elements are disposed on a semiconductor wafer substrate to achieve at least 2000 PPI, then display resolution is improved, but production yield decreases and repair difficulty increases
Solution Approach 1:
The display panel is divided into multiple independently driven display driving circuits, each controlling a specific region of pixels. This segmentation allows individual circuits to be replaced or repaired without affecting the entire display panel, thereby maintaining high resolution while improving production yield and repairability
Solution Approach 2:
Contact holes are formed in the semiconductor wafer substrate to establish electrical connections between the display driving circuits on the first side and the pixel driving circuits on the second side. This intermediary connection method enables independent driving of display regions while maintaining the high-resolution OLEDoS structure
2Manufacturing precision
If high-resolution light emitting elements are disposed on a semiconductor wafer substrate to achieve at least 2000 PPI, then display resolution is improved, but repair difficulty increases
Solution Approach 1:
The display panel is divided into multiple independently driven display driving circuits, each controlling a specific region of pixels. This segmentation allows individual circuits to be replaced or repaired without affecting the entire display panel, thereby maintaining high resolution while improving production yield and repairability
Solution Approach 2:
The dual-sided structure with independently driven circuits enables defective regions to be identified and replaced individually. Healthy regions can be recovered and continue to function, allowing partial repair of the display panel without discarding the entire high-resolution display
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the production yield of display panels and simplifies the repair process, thereby reducing manufacturing costs and ensuring high-quality, high-resolution displays for wearable devices.
Implementation Method 1
a light emitting element layer disposed on the second side of the semiconductor wafer substrate and including a light emitting element driven by the plurality of pixel driving circuits
Data Source
AI summary
A display device and a method for manufacturing the same are disclosed. The display device includes: a display panel, wherein the display panel includes: a semiconductor wafer substrate; a complementary metal oxide semiconductor (CMOS) layer disposed on a first side of the semiconductor wafer substrate and including a plurality of display driving circuits that are driven independently of each other; a transistor layer disposed on a second side of the semiconductor wafer substrate and including a plurality of pixel driving circuits connected to the plurality of display driving circuits through a contact hole in the semiconductor wafer substrate; a light emitting element layer disposed on the second side of the semiconductor wafer substrate and including a light emitting element driven by the plurality of pixel driving circuits; and an encapsulation layer disposed on the second side of the semiconductor wafer substrate.