Substrate Processing Layout With Direct Batch Transfer Bypass
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Solution Overview
Problem
Conventional substrate processing systems face a throughput deterioration due to the increased load on the second transport device, which is used to transport substrates through the single-wafer processing device and between other devices.
Innovation Solution
The substrate processing system incorporates a transfer device with a carrier shelf that stores substrates in a horizontal orientation, a batch processing device for processing multiple substrates at once, and a single-wafer processing device. The system includes a first orientation converting unit that converts substrates from horizontal to vertical orientation, and a first batch transport mechanism that directly transports vertically oriented substrates from the transfer device to the batch processing unit, bypassing the single-wafer processing device's transport mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transported through the single-wafer processing device using the second transport device, then substrates can be transferred from the loading/unloading device to the interface device, but the load on the second transport device increases and throughput deteriorates
Solution Approach 1:
The transport function is segmented into two separate mechanisms: the first batch transport mechanism for transporting multiple substrates in batch mode, and the second transport device for single-substrate processing. This segmentation allows each mechanism to be optimized for its specific function, with the first batch transport mechanism handling bulk substrate transport to improve throughput while the second transport device handles individual substrate processing.
Solution Approach 2:
The first batch transport mechanism acts as an intermediary between the loading/unloading device and the batch processing device, providing a dedicated transport path for batch substrate movement. This intermediary mechanism relieves the second transport device from handling bulk substrate transport, allowing it to focus on single-substrate operations and thereby improving overall system throughput.
2Quantity of substance
If the second transport device is used to transport multiple substrates through the single-wafer processing device, then batch processing can be enabled, but the transport device becomes a bottleneck
Solution Approach 1:
The transport system is divided into two independent paths: a batch transport path using the first batch transport mechanism for moving multiple substrates simultaneously, and a single-substrate transport path using the second transport device. This segmentation enables batch processing capability while maintaining high transport speed on the single-substrate path, eliminating the bottleneck effect.
Solution Approach 2:
The system transitions from a single-dimensional transport approach (one transport device handling all substrate movement) to a two-dimensional transport architecture with parallel batch and single-substrate transport paths. This dimensional expansion allows simultaneous handling of multiple substrates at different processing stages, improving both quantity processed and transport speed.
Data Source
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Figure 3A~3F
AI summary
A substrate processing system includes a transfer device provided with a shelf, a batch processing device, and a single-wafer processing device. The transfer device, the single-wafer processing device, and the batch processing device are linearly arranged in a row, in the order listed herein. The batch processing device includes a first batch transport mechanism that transports a plurality of substrates to a batch process bath, for example, all at once. The first batch transport mechanism receives the plurality of substrates converted into the vertical orientation on the transfer device side, and transports the substrates to, for example, a batch process bath directly, without using a substrate transport robot in the single-wafer processing device.