Wafer Bevel Brush Cleaning for Edge Film Removal
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Solution Overview
Problem
Wafer edge film defects such as cracking, delaminating, peeling, and flaking during semiconductor manufacturing lead to contamination and deep scratches, reducing chip production yields and reliability.
Innovation Solution
A bevel film removal tool integrated into a CMP system that cleans and removes damaged films from the bevel regions of semiconductor wafers using a bevel brush and cleaning solution, ensuring the integrity of the wafer edge before further processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If films are deposited over the semiconductor wafer, then the wafer structure is completed, but wafer edge film defects occur leading to contamination and scratches
Solution Approach 1:
The bevel brush removes films from the bevel region before subsequent manufacturing steps occur. This preliminary removal prevents the films from later cracking, delaminating, peeling, or flaking off and causing contamination or deep scratches during handling and processing.
Solution Approach 2:
The invention extracts and removes the potentially harmful films specifically from the bevel region of the wafer edge. By taking out these films before they can cause damage, the system prevents contamination and scratches while leaving the rest of the wafer structure intact.
2Reliability
If a bevel brush is used to remove films from the bevel region, then contamination and scratches are prevented, but the device complexity increases
Solution Approach 1:
The bevel brush is integrated into the existing CMP system, allowing the same system to perform both conventional CMP polishing and bevel region film removal. This multi-functionality increases reliability without requiring a completely separate dedicated system.
Solution Approach 2:
The invention combines the bevel brush mechanism with the existing CMP system architecture. By merging these functions into a single integrated system, the complexity increase is minimized while achieving the dual benefit of film removal and contamination prevention.
3Productivity
If the bevel brush rotates at high speed, then film removal efficiency increases, but the risk of causing new damage increases
Solution Approach 1:
The bevel brush rotates periodically with controlled speed variations. The rotation speed can be adjusted to optimize film removal while periodic contact patterns prevent excessive force concentration, reducing the risk of new damage while maintaining productivity.
Solution Approach 2:
The system controls and adjusts the rotation speed parameter of the bevel brush to optimize the balance between film removal efficiency and damage prevention. By carefully managing this parameter, high productivity is achieved without increasing the risk of new wafer damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination and scratches by effectively removing potentially damaging films from the wafer edge, enhancing the reliability and yield of semiconductor chip production.
Implementation Method 1
abrading the bevel region of the workpiece
Implementation Method 2
the first surface of the brush interfacing a bevel region of the workpiece; rotating at least one of the brush or the workpiece
Implementation Method 3
dispensing a cleaning solution at the bevel brush
Data Source
AI summary
A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.