Wafer Bevel Brush Removal for CMP Edge Film Defects
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Solution Overview
Problem
Chemical mechanical polish (CMP) processes in semiconductor manufacturing often result in wafer edge film defects such as cracking, delaminating, and peeling, leading to potential contamination and low chip production yields and reliability due to excess material at the wafer edges.
Innovation Solution
A bevel film removal tool integrated into the CMP system that includes a bevel brush and motor configuration for rotating the wafer and brush, combined with a cleaning solution, to remove potentially damaging films and materials from the bevel region of semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CMP processes are performed to remove excess materials and planarize the semiconductor wafer, then the wafer surface is flattened and excess material is removed, but wafer edge film defects such as cracking, delaminating, and peeling occur
Solution Approach 1:
The bevel brush removes excess material from the wafer edge bevel region before subsequent manufacturing steps. By performing this preliminary removal action, the patent prevents film defects (cracking, delaminating, peeling) from occurring during later handling and processing, thus maintaining film integrity while enabling effective CMP planarization
Solution Approach 2:
The invention segments the material removal process into two distinct zones: the wafer surface area treated by CMP for planarization, and the wafer edge bevel region treated separately by the bevel brush. This segmentation allows each process to optimize for its specific function without compromising the other, preventing the film defects that occur when CMP alone is used
2Productivity
If excess material remains at the wafer edges, then additional material can be processed, but contamination and deep scratches occur during subsequent handling and manufacturing steps
Solution Approach 1:
The bevel brush extracts and removes excess material from the wafer edge bevel region separately from the main wafer surface. By taking out this potentially harmful excess material before subsequent processing steps, the patent prevents contamination and deep scratches while maintaining the ability to process additional material
Solution Approach 2:
The invention converts the potentially harmful excess material at the wafer edges into a beneficial situation by using the bevel brush to selectively remove it. The excess material that would otherwise cause contamination and scratches is transformed into a controlled removal process that actually protects the wafer from these harmful effects during subsequent handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination and deep scratches during subsequent processing by ensuring the integrity of the semiconductor substrate, reducing the need for additional cleaning steps and improving chip production yields and reliability.
Implementation Method 1
abrading the bevel region of the workpiece
Implementation Method 2
distributing a cleaning solution to the bevel region of the workpiece
Data Source
AI summary
A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.