Wafer Boat Shell Structure for Uniform Deposition
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Solution Overview
Problem
Existing wafer boat systems experience non-uniformity in material deposition across semiconductor wafers due to radial gas supply, leading to edge effects and inefficiencies in processing.
Innovation Solution
A wafer boat system featuring a carrier with a shell that replaces traditional rods, providing circumferentially spaced ring support slots and gas transmission openings to enhance uniformity and efficiency of wafer processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional rods are used to support wafers in the carrier, then structural support is provided, but non-uniformity in material deposition occurs due to localized presence near wafer edges
Solution Approach 1:
The patent removes the traditional rod support structure from the carrier and replaces it with a shell structure having ring support slots. This extraction eliminates the harmful localized presence of rods near wafer edges, thereby reducing edge effects and improving deposition uniformity across the wafer surface.
Solution Approach 2:
The patent employs a shell structure with circumferentially spaced ring support slots to support the wafers. The shell design distributes the structural support function across multiple axial series of slots, creating a more uniform gas flow path and eliminating the localized disruption caused by traditional rods, thus improving deposition uniformity.
2Reliability
If rods are positioned close to wafer edges for structural support, then holder stability is maintained, but harmful edge effects increase with non-uniform deposition
Solution Approach 1:
The patent segments the continuous rod structure into discrete ring support slots distributed circumferentially around the carrier. This segmentation allows the support function to be distributed across multiple locations, maintaining holder stability while eliminating the harmful concentration of structural elements near wafer edges that causes edge effects.
3Manufacturing precision
If a shell structure with ring support slots is used instead of rods, then deposition uniformity improves, but structural performance must be maintained
Solution Approach 1:
The shell structure serves multiple functions simultaneously: it provides structural support for the wafers through ring support slots, maintains carrier integrity, and enables uniform gas flow distribution. This multi-functionality allows the shell to replace traditional rods while maintaining both structural performance and deposition uniformity.
4Strength
If traditional rod-based carrier design is used, then structural support is achieved, but wafer processing efficiency decreases due to access limitations
Solution Approach 1:
The shell structure is segmented with circumferentially spaced ring support slots that create openings for transverse access. This segmentation allows automated systems to efficiently load and unload holder rings with wafers from the side, improving wafer processing efficiency while the shell maintains overall structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shell design improves deposition uniformity by distributing the effect of gas supply more evenly along the circumference, while maintaining or improving structural performance and allowing for efficient movement of holder rings and wafers.
Implementation Method 1
axial series of gas transmission openings are formed in the shell between the axial series of slots
Data Source
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AI summary
A wafer boat system comprising: a carrier extending along a carrier axis and comprising a first end member at a first axial end of the carrier, a second end member at a second axial end of the carrier, and a shell connecting the first end member with the second end member, wherein at least three circumferentially spaced apart axial series of ring support slots are provided to the shell, the ring support slots defining axially spaced apart holder ring positions; and a plurality of holder rings each engageable with the ring support slots to position the holder ring in the carrier at one of the holder ring positions, wherein the holder ring is configured to support a wafer in the carrier, wherein the shell circumferentially interconnects the axial series of slots, wherein axial series of gas transmission openings are formed in the shell between the axial series of slots.