Temporary Wafer Bonding Adhesive for Strong Hold and Easy Release
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing adhesive compositions used for temporary adhesion in semiconductor wafer processing do not provide sufficient adhesiveness to diverse adherends and encapsulating resins, leading to potential deformation or detachment during polishing and difficult removal post-processing.
Innovation Solution
A curable adhesive composition containing a compound with a linear or branched alkyl chain of 5 or more carbon atoms, cured by hydrosilylation reaction, forming an adhesive layer with good adhesiveness to semiconductor substrates and encapsulating resins, and allowing easy release post-processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If adhesives containing polydimethylsiloxane are used for temporary adhesion, then easy removal after polishing is achieved, but adhesiveness to diverse adherends and encapsulating resins is insufficient
Solution Approach 1:
The patent uses a composite adhesive composition containing polydimethylsiloxane as the base adhesive component and adds a compound with a linear or branched alkyl chain having 5 or more carbon atoms. This composite approach combines the easy removal property of polydimethylsiloxane with the enhanced adhesiveness to diverse materials provided by the alkyl chain compound, resolving the contradiction between ease of removal and adhesiveness to diverse adherends
Solution Approach 2:
The patent modifies the adhesive composition by introducing a compound with specific molecular weight (150-600) and specific alkyl chain length (5 or more carbon atoms). By controlling these molecular parameters, the adhesive achieves both sufficient adhesion to diverse materials including encapsulating resins and easy removability after polishing, thus resolving the contradiction through parameter optimization
2Strength
If strong adhesion is used during polishing, then polishing stress is withstood, but removal after polishing becomes difficult
Solution Approach 1:
The patent carefully controls the molecular weight of the alkyl chain compound (150-600) and its content (0.1-5% by mass) to achieve optimal adhesion strength during polishing while maintaining easy removability after polishing. The specific parameter ranges balance the competing requirements of strong holding during processing and easy release afterward
Solution Approach 2:
The compound with linear or branched alkyl chain acts as an intermediary component that mediates between the polydimethylsiloxane base adhesive and the diverse adherends. It provides sufficient adhesion strength during polishing while the polydimethylsiloxane base ensures easy removal after polishing, thus resolving the contradiction through intermediary action
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition ensures strong adhesion during polishing while enabling easy separation, preventing deformation and detachment, and maintaining adhesiveness to various materials.
Implementation Method 1
The adhesive composition is a curable adhesive composition, and is an adhesive composition cured by a hydrosilylation reaction
Data Source
Figure 1~3
Figure 4A~6
Figure 7A~7C
AI summary
An adhesive composition contains a compound having no siloxane bond and having a linear or branched alkyl chain having 5 or more carbon atoms, in which the adhesive composition is a curable adhesive composition used for forming an adhesive layer of a laminate including a semiconductor substrate or an electronic device layer, a support substrate, and the adhesive layer provided between the semiconductor substrate or the electronic device layer and the support substrate.